Micro Mechanical Behaviors of Sn, SnPb and SnAg Solder Alloys during In-Situ Tensile Testing under TEM

著录项

• 来源
  《IMAPS 40th international symposium on microelectronics》|2007年|p.1-8|共8页
• 会议地点 San Jose CA(US)
• 作者

  Chunqing Wang; Ying Ding;

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• 作者单位

  Dept. of Electronics Packaging Technology, School of Materials Science and Engineering,Harbin Institute of Technology 92, Xidazhi Street, Nangang, Harbin 150001, P.R. China Tel: +86 451 86418725, Fax: +86 451 86416186, E-mail: wangcq@hit.edu.cn;

  Dept. of Electronics Packaging Technology, School of Materials Science and Engineering,Harbin Institute of Technology 92, Xidazhi Street, Nangang, Harbin 150001, P.R. China Tel: +86 451 86418725, Fax: +86 451 86416186;

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• 会议组织
• 原文格式 PDF
• 正文语种 eng
• 中图分类 微电子学、集成电路（IC）;
• 关键词

  Solder alloys; In-situ; Tensile test; TEM; Micro mechanical behavior;

  机译：焊料合金；原位拉伸试验； TEM;微观机械行为;