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首页> 外文会议>IMAPS 40th international symposium on microelectronics >Evaluation of Removal Rate of Cured Silicone Adhesive from Various Electronic Packaging Substrates by Solvent and Silicone Digesters for Rework Applications
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Evaluation of Removal Rate of Cured Silicone Adhesive from Various Electronic Packaging Substrates by Solvent and Silicone Digesters for Rework Applications

机译：通过返工的溶剂和有机硅消解剂评估各种电子封装基板上的固化有机硅胶粘剂的去除率

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摘要

Reworking electronic packages is an integral process related to diagnostics and salvaging valuable materials. It is a meticulous and time-consuming procedure that requires some knowledge of the package material composition to determine compatible cleaning solutions and processes. Silicone adhesives are being used more frequently due to their ability to minimize shear stress during temperature cycling. A common method for removing silicone adhesive is by swelling in solvent and removing by mechanical methods taking care not to damage fragile materials and leave minimal residue. Silicone digesters (emulsifiers) are another means of removing cured silicone. They are comprised of weak acids or bases and remove silicone by breaking the siloxane bonds that make up the polymer matrix. They are able to penetrate into areas that are difficult,or impossible to reach,greatly reducing the risk of causing damage due to mechanical removal. The purpose of this study is to evaluate the rate of silicone removal by solvents and silicone digesters on silicones bonded to copper and aluminum. The removal rate was determined by developing a rating system based on time intervals where silicone was observed to delaminate or dissolve. Silicone adhesives and Thermal Interface Materials (TIMs) were used in the evaluation of two commonly used solvents and two commercially available silicone digesters. Copper and aluminum panels were evaluated by using a ～0.5 mm thick layer of silicone to bond 2 panels together. The samples were placed in cleaning solution for 24 hours at 40 degree Celsius and evaluated at specific intervals for any changes in appearance of silicone. Based on the performance of combinations of silicone,substrate and cleaner,the engineer can chose which method is best for reworking based on their own assembly configuration and materials.
机译：返工电子封装是与诊断和挽救宝贵材料有关的必不可少的过程。这是一种细致且耗时的过程，需要一些包装材料成分的知识才能确定兼容的清洗溶液和工艺。由于有机硅胶粘剂具有在温度循环过程中将剪切应力减至最小的能力，因此被更频繁地使用。去除有机硅粘合剂的常用方法是在溶剂中溶胀，然后通过机械方法去除，注意不要损坏易碎的材料并留出最少的残留物。有机硅蒸煮器（乳化剂）是去除固化有机硅的另一种方法。它们由弱酸或弱碱组成，并通过破坏构成聚合物基质的硅氧烷键来除去有机硅。它们能够渗透到难以到达或无法到达的区域，从而大大降低了由于机械拆除而造成损坏的风险。这项研究的目的是评估溶剂和有机硅蒸煮器对结合到铜和铝上的有机硅的有机硅去除率。通过基于观察到有机硅分层或溶解的时间间隔开发等级系统来确定去除速率。硅酮粘合剂和热界面材料（TIMs）用于评估两种常用溶剂和两种市售硅酮蒸煮器。通过使用〜0.5 mm厚的有机硅层将2个面板粘合在一起，对铜和铝面板进行了评估。将样品在40摄氏度的清洁溶液中放置24小时，并以特定的时间间隔评估有机硅外观的任何变化。根据有机硅，基材和清洁剂的组合性能，工程师可以根据自己的组装配置和材料选择最适合返工的方法。

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