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首页> 外文会议>IMAPS 40th international symposium on microelectronics >Integrated EMI Shield for RF Modules: Packaging Technology, Simulation and Characterization
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Integrated EMI Shield for RF Modules: Packaging Technology, Simulation and Characterization

机译：用于射频模块的集成EMI屏蔽：封装技术，仿真和表征

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摘要

For next-generation highly-integrated MCM packaging for RF modules and analog circuits,electromagnetic interference (EMI) issues are critical to RF performance. As RF modules require higher levels of miniaturization,more demands are placed on the package layout,component placement as well as the shield above the components within the module. With continued reduction on module size,electromagnetic interference between the various sections can severely impact the overall module RF performance. In this work,integrated shielding technologies are investigated and evaluated in order to eliminate or mitigate the effect of electromagnetic interference (EMI) within the same module and from the module to the outside. New packaging technologies and assembly processes are developed to implement the integrated shield in RF Modules. Electromagnetic numerical modeling is used to predict the effects of different shielding solutions and a series of experiments are conducted to verify the simulation results and determine the shield effectiveness in EMI isolations.
机译：对于用于RF模块和模拟电路的下一代高度集成的MCM封装，电磁干扰（EMI）问题对于RF性能至关重要。由于RF模块要求更高的小型化水平，因此对封装布局，组件放置以及模块内组件上方的屏蔽层提出了更高的要求。随着模块尺寸的不断减小，各个部分之间的电磁干扰会严重影响整个模块的RF性能。在这项工作中，对集成屏蔽技术进行了研究和评估，以消除或减轻同一模块内部以及从模块到外部的电磁干扰（EMI）的影响。开发了新的封装技术和组装工艺，以在RF模块中实现集成屏蔽。电磁数值建模用于预测不同屏蔽解决方案的效果，并进行了一系列实验以验证仿真结果并确定EMI隔离中的屏蔽效果。

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