• 主题
高级搜索  >
历史搜索 清空历史
首页> 外文会议>IMAPS 40th international symposium on microelectronics >Pre-flowed Gold/Tin for Hermetic Package Sealing and Die Attach
【24h】

Pre-flowed Gold/Tin for Hermetic Package Sealing and Die Attach

机译：预流金/锡，用于密封包装和管芯连接

获取原文
获取原文并翻译 | 示例
页面导航
  • 摘要
  • 著录项
  • 相似文献
  • 相关主题

摘要

Historically the method of sealing hermetic packages has been accomplished using a gold/tin preform that is tack welded to a gold plated kovar lid. New technology has been developed whereby the gold/tin solder is pre-deposited and wetted to the outside area of the lid. This technique offers the following advantages:rn a) Cost – since the only material required is the gold/tin actually placed on the lid the cost of alloying,casting,rolling,stamping and welding of the preform is eliminated. Less gold can be used generating a large cost savings.rnb) Yield – often the gold/tin preform that is tack welded develops cracks or slivers that cause nonhermetic seals and thus a yield loss occurs. This new process provides a fully bonded interface between the lid and the gold/tin with optimal uniformity of solder. rnc) Void free bonding – the pre-wetted gold/tin forms a metallurgical bond on the lid that is free of voids and dewet areas which insures hermeticity. The Gold-N-Flo process has been approved for use in space level devices. rnd) Process repeatability – the process to pre-wet the gold/tin eliminates placement errors of a tack welded gold/tin lid in the x,y and theta axis which is sometimes a problem. rnThe paper will show by X-ray technology,as well as cross-section analysis,the absence of voiding,the consistency of the solder thickness and the exactness of the solder location in the x and y axis. We will also demonstrate by slide presentation,using this unique system for pre-positioning gold/tin can aid in multiple die bonding,multi level soldering of components and special MEMS soldering applications. Using the same technique we will demonstrate the possibilities of depositing gold/germanium for die attach. We will also discuss the applicability of placing brazing alloys,especially silver/copper eutectic,onto lead frames. This can eliminate the need for inlayed material greatly affecting the cost of the package. Questions regarding other yet unexplored areas of interest will be addressed.
机译：从历史上看，密封包装的方法是使用金/锡预成型件完成的，该预成型件被点焊到镀金的可伐铁盖上。已经开发了新技术，金/锡焊料被预先沉积并润湿到盖子的外部区域。该技术具有以下优点：a）成本–由于所需的唯一材料是实际放置在盖子上的金/锡，因此消除了预成型件的合金化，铸造，轧制，压印和焊接的成本。可以使用较少的金，从而节省大量成本。rnb）产量–进行点焊的金/锡预成型坯经常会产生裂纹或碎片，从而导致非气密性密封，从而导致产量下降。这种新工艺在盖子和金/锡之间提供了完全粘合的界面，并具有最佳的焊料均匀性。 rnc）无空隙结合-预先润湿的金/锡在盖子上形成冶金结合，没有空隙和润湿区域，确保了密封性。 Gold-N-Flo工艺已被批准用于太空设备。 rnd）工艺可重复性–预浸金/锡的工艺消除了有时会出现问题的点焊金/锡盖在x，y和theta轴上的放置误差。 rn本文将通过X射线技术以及横截面分析，无空隙，焊锡厚度的一致性以及焊锡在x和y轴上的位置的精确性进行展示。我们还将通过幻灯片演示进行演示，使用这种独特的金/锡预定位系统可以帮助进行多芯片键合，组件的多级焊接以及特殊的MEMS焊接应用。使用相同的技术，我们将演示沉积金/锗以进行芯片附着的可能性。我们还将讨论在引线框架上放置钎焊合金（尤其是银/铜共晶）的适用性。这可以消除对镶嵌材料的需求，从而极大地影响了包装的成本。有关其他尚未探索的兴趣领域的问题将得到解决。

著录项

  • 来源
  • 会议地点 San Jose CA(US)
  • 作者

    K.Huth; V. Tanzi; C. Italiano; L. Monterulo; Z. Guo;

  • 作者单位

    Semiconductor Packaging Materials Co.Armonk, NY 10504 Ph: (914) 273-5500 Fax: (914) 273-2065;

    Semiconductor Packaging Materials Co.Armonk, NY 10504 Ph: (914) 273-5500 Fax: (914) 273-2065 Email: vtanzi@sempck.com;

    Semiconductor Packaging Materials Co.Armonk, NY 10504 Ph: (914) 273-5500 Fax: (914) 273-2065;

    Semiconductor Packaging Materials Co.Armonk, NY 10504 Ph: (914) 273-5500 Fax: (914) 273-2065;

    Semiconductor Packaging Materials Co.Armonk, NY 10504 Ph: (914) 273-5500 Fax: (914) 273-2065;

  • 会议组织
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 微电子学、集成电路（IC）;
  • 关键词

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱：kefu@zhangqiaokeyan.com

京公网安备：11010802029741号 ICP备案号：京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有

  • 客服微信

  • 服务号