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首页> 外文会议>IMAPS 40th international symposium on microelectronics >Lowering the Cost of Flip Chip Interconnections Using a Single Chamber, Multi-Metal, Bump Plating Tool
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Lowering the Cost of Flip Chip Interconnections Using a Single Chamber, Multi-Metal, Bump Plating Tool

机译：使用单腔多金属凸点电镀工具降低倒装芯片互连的成本

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The growth of flip chip packaging has been hindered by lack of infrastructure and tools for producing low cost bumps. The plating equipment base for bumping today is older multi-tank technology. This equipment typically requires significant floor space and is not capable of handling the small lots and quick changeovers required by the back end assembly facilities. The wire bonding equipment model has been well accepted within back end assembly. This model is built around individual machines with small footprints that are justified based on incremental capacity increases and fast ROI. The user friendly Graphic User Interface (GUI),the ease of programmability and the quick changeover capability make this model the standard to emulate for new equipment designed for package assembly.rn This design concept has been used to develop an innovative single-chamber plating tool,capable of producing multimetal layered bumped wafers. This plating tool,which has a footprint similar to that of a wire bonder,handles one wafer at a time and plates at high speed through improved reaction kinetics and control. The single wafer chamber is designed to enable quick changeovers,efficient chemical usage,and requires less rinsing volume (less waste water treatment). Custom designed PLC and software provide easy programmability and recipe portability enabling flexibility in process definition and recipe management. Data logging and acquisition provide data collection of both key mechanical and process metrics.rn The tool is capable of plating a wide range of metals and alloys providing a broad range of application in the market. Using the multi-layered metal stacks allows development of a full range of lead-free and high performance metal systems. Copper pillar structures can be capped by a solder layer and then reflowed to provide a reliable solder connection. Both electrolytic and electroless nickel-gold bumping are currently available chemistries with this single chamber approach.
机译：倒装芯片封装的增长由于缺乏生产低成本凸块的基础设施和工具而受到阻碍。如今，用于碰撞的电镀设备基础是较旧的多罐技术。该设备通常需要大量的地面空间，无法处理后端组装设备所需的小批量和快速更换。引线键合设备模型已在后端组件中很好地接受。该模型是围绕具有较小占地面积的单个机器构建的，这些机器根据增加的容量增加和快速的ROI来证明是合理的。用户友好的图形用户界面（GUI），易于编程和快速转换功能使该模型成为用于包装组装的新设备的标准模型。rn该设计概念已用于开发创新的单室电镀工具，能够生产多层多金属凸点晶片。这种电镀工具的占地面积与引线键合机相似，可一次处理一个晶片，并通过改进的反应动力学和控制来高速电镀。单晶片腔室的设计可实现快速转换，高效地使用化学药品，并需要较少的冲洗量（较少的废水处理）。定制设计的PLC和软件提供了容易的可编程性和配方可移植性，从而使过程定义和配方管理具有灵活性。数据记录和采集可提供关键机械指标和过程指标的数据收集。该工具能够镀覆各种金属和合金，从而在市场上提供广泛的应用。使用多层金属堆叠可以开发各种无铅和高性能金属系统。铜柱结构可以被焊料层覆盖，然后回流以提供可靠的焊料连接。通过这种单室方法，电解和化学镀镍金凸点目前都是可用的化学方法。

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