New thick film conductor pastes on AlN for Pb-free solder

机译：在AlN上的新型厚膜导体浆料，用于无铅焊料

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The aim of the investigation at IKTS was the development of a new conductor paste for Aluminum nitride ceramic substrates,which can be used for lead-free soldering and shows both good film characteristics and good cost-effectiveness. To characterize possible correlations between paste components,like alloying elements,inorganic binder,and film properties different analytical methods were carried out. Microscopy and FESEM were used to characterize surface properties. Adhesion (wire peel test) and solder leach resistance were determined to investigate soldering characteristics. The results show that an influence could be found for the metal alloy composition and for the components of the inorganic binder.

机译：在IKTS上进行研究的目的是开发一种新的用于氮化铝陶瓷基板的导体浆料，该浆料可用于无铅焊接，并具有良好的薄膜特性和良好的成本效益。为了表征糊成分之间的可能相关性，如合金元素，无机粘合剂和薄膜性能，进行了不同的分析方法。使用显微镜和FESEM表征表面性能。确定粘合性（电线剥离试验）和耐焊料浸出性，以研究焊接特性。结果表明，可以发现对金属合金组成和无机粘结剂的成分的影响。

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来源
《IMAPS 40th international symposium on microelectronics》|2007年|p.1-7|共7页
会议地点 San Jose CA(US)
作者
Melanie Hentsche; Christel Kretzschmar; Chriffe Belda;
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作者单位

Fraunhofer Institute for Ceramic Technologies and Systems Winterbergstr. 28 01277 Dresden Germany Phone: +493512553511 Fax: +493512554307 Email: Melanie.Hentsche@ikts.fraunhofer.de;

Fraunhofer Institute for Ceramic Technologies and Systems Winterbergstr. 28 01277 Dresden Germany Phone: +493512553511 Fax: +493512554307;

Fraunhofer Institute for Ceramic Technologies and Systems Winterbergstr. 28 01277 Dresden Germany Phone: +493512553511 Fax: +493512554307;

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原文格式 PDF
正文语种 eng
中图分类微电子学、集成电路（IC）;
关键词
Aluminum nitride; conductor; Pb-free solder; thick film;

机译：氮化铝;导体;无铅焊料；厚膜;

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1. SOLDERING CHARACTERISTICS AND THERMO- MECHANICAL PROPERTIES OF Pb-FREE SOLDER PASTE FOR REFLOW SOLDERING [J] . A.M. Najib, M.Z. Abdullah, A.A Saad, Journal of Advanced Manufacturing Technology . 2019,第2期

机译：回流焊用无铅锡膏的焊接特性和热机械性能
2. Fabrication of Pb-free Silver Paste and Thick Film Adding Silver Nanoparticles [J] . Sung Hyun Park, Dong Seok Seo, Jong Kook Lee Diffusion and Defect Data. Solid State Data, Part B. Solid State Phenomena . 2007,第1期

机译：无铅银浆和添加银纳米颗粒的厚膜的制备
3. Glass frit content—Property co-relation in thick films of photoimageable silver conductor paste [J] . Supriya A. Ketkar, Govind G. Umarji, Girish J. Phatak, Materials Science and Engineering. B, Solid-State Materials for Advanced Technology . 2006,第1a2期

机译：玻璃粉含量—可光成像的银导体浆料厚膜中的性能相互关系
4. New thick film conductor pastes on AlN for Pb-free solder [C] . Melanie Hentsche, Christel Kretzschmar, Chriffe Belda International Symposium on Microelectronic . 2007

机译：新的厚膜导体浆料在ALN的无铅焊料上
5. Synthesis, Formulation, and Reliability Study of Novel Pb-Free Nanocomposite Solder Pastes for Electronics Assembly and Packaging [D] . Wernicki, Evan . 2020

机译：用于电子组装和包装的新型PB无铅纳米复合材料焊膏的合成，制剂和可靠性研究
6. Heteroepitaxial Growth of High-Quality and Crack-Free AlN Film on Sapphire Substrate with Nanometer-Scale-Thick AlN Nucleation Layer for AlGaN-Based Deep Ultraviolet Light-Emitting Diodes [O] . Jie Zhao, Hongpo Hu, Yu Lei, 2019

机译：蓝宝石衬底上具有纳米尺度厚AlN成核层的高质量无裂纹AlN薄膜的异质外延生长用于基于AlGaN的深紫外发光二极管
7. Current Situation and Issues of Soldering Technology in the Pb-Free Solder Age. The Results of Recent Research in Lead Free Solder Paste. [O] . Toshinori SHIMA 1996

机译：PB免焊期焊接技术的现状及问题。铅免焊膏最近研究的结果。
8. Mechanical properties of Pb-free solder alloys on thick film hybrid microcircuits [R] . Hernandez, C. L. , Vianco, P. T. , Rejent, J. A. , 1998

机译：厚膜混合微电路上无铅焊料合金的力学性能

New thick film conductor pastes on AlN for Pb-free solder

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