• 主题
高级搜索  >
历史搜索 清空历史
首页> 外文会议>IMAPS 40th international symposium on microelectronics >Board Level Reliability of Solid State Camera Modules
【24h】

Board Level Reliability of Solid State Camera Modules

机译：固态摄像头模块的板级可靠性

获取原文
获取原文并翻译 | 示例
页面导航
  • 摘要
  • 著录项
  • 相似文献
  • 相关主题

摘要

In common with most semiconductor devices,solid state camera modules are required to meet reliability standards before the product is deemed to be of sufficient quality for commercial release. The packaged silicon die at the heart of each solid state camera module are assessed against Standard tests but,surprisingly,there are no industry standards for complete camera modules. Although the camera module manufacturers subject components to their own internal evaluations the picture is further confused because some of these tests are conducted with the lens train in place and others without. rnThe first part of this paper will review camera module test regimes in use today with particular emphasis on whether the lens train should be present. Proposed is a bare minimum specification that next generation camera modules would be expected to pass for use in mobile phones. rnThe trend in solid state imagers is towards ever higher resolution devices and smaller pixel dimensions. However resolution is increasing faster than smaller pixels and technology nodes are being introduced. The net result is imager die in micro ball grid array,chip scale packages,are now broaching the 5mm x 5mm boundary beyond which direct attachment to a printed circuit board is not possible. The second part of this paper will present a practical strategy that can be adopted to enable physically large imager die to meet board level reliability Standards.
机译：与大多数半导体设备一样，固态摄像头模块需要满足可靠性标准，然后才能认为该产品具有足够的商业发行质量。每个固态摄像头模块核心的封装硅芯片均经过标准测试评估，但是令人惊讶的是，没有完整的摄像头模块的行业标准。尽管相机模块制造商会对其组件进行内部评估，但图片会更加混乱，因为其中一些测试是在镜头架安装到位的情况下进行的，而其他测试是在没有安装镜头架的情况下进行的。 rn本文的第一部分将回顾当今使用的相机模块测试制度，特别着重于是否应配备镜头列。提出了最低的最低规格，即下一代相机模块有望通过在手机中使用。 rn固态成像仪的趋势是朝着更高分辨率的设备和更小的像素尺寸发展。但是，分辨率的提高速度要快于较小的像素，并且正在引入技术节点。最终结果是，成像器芯片采用微型球栅阵列，芯片规模的封装，现在拉削了5mm x 5mm的边界，超出该边界则无法直接连接至印刷电路板。本文的第二部分将介绍一种可行的策略，可以采用该策略使物理上较大的成像器裸片满足板级可靠性标准。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱：kefu@zhangqiaokeyan.com

京公网安备：11010802029741号 ICP备案号：京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有

  • 客服微信

  • 服务号