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首页> 外文会议>IMAPS 40th international symposium on microelectronics >A Generalized Wide Band Model for 3D Multi-Chip Microwave Integrated Circuits and Packaging Technique Adaptable to Satellite Applications
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A Generalized Wide Band Model for 3D Multi-Chip Microwave Integrated Circuits and Packaging Technique Adaptable to Satellite Applications

机译：适用于卫星应用的3D多芯片微波集成电路的通用宽带模型和封装技术

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摘要

Next generation satellite systems are geared towards traditional satellite busses, “Small Sat” and more recently “Micro Sat” bus concepts, which extensively need the use of “On Board Processors” (OBP). Most of these satellite systems are designed to operate in L,C, Ku and Ka frequency bands and deploy both analogue and digital processors with increased functionality and flexibility in less available space. Efficient cost effective solutions providing enhancements in payload processor mass, and size whilst maintaining electrical performance over a wide frequency band can be accomplished by deploying advanced technologies. These include utilizing mature multilayer circuit board (MLPCB) technology, (incorporating integrated passive elements), integrated with multi-chip RF functional modules rnThis paper describes a high fidelity multi-chip MMIC package modelling approach, which offers significant improvement in performance predictions and performance correlation between analytical models and test data. The increased level of integration and multiple functionality afforded by this design approach enables potential savings in mass, size and cost of the functional modules. The technique uses a combination of lumped element and distributed element transmission line approaches to characterize circuit elements and inter-layer transitions within multilayer printed circuit board (MLPCB) with its attributes developed to cover a wide operating frequency band. The model also includes effects of processing techniques, interconnects and 3D RF integration topology (e.g.: package surface mount attachment processes, wire bond interconnects and multilayer wide band RF via transitions). The developed equivalent circuit model addresses RF, mechanical and processing attributes of a MMIC package / MLPCB assembly to derive design parameters adaptable to wide ranging applications rnThe equivalent circuit model is further validated with measured results. To date, the model has been verified for different wide band active and passive microwave networks.
机译：下一代卫星系统面向传统的卫星总线，“小卫星”和最近的“微型卫星”总线概念，这些概念都需要使用“机载处理器”（OBP）。这些卫星系统中的大多数都设计为在L，C，Ku和Ka频带上运行，并在可用空间较小的情况下部署具有增强功能和灵活性的模拟和数字处理器。通过部署先进技术，可以在提供有效载荷处理器质量和尺寸的同时，在较宽的频带范围内保持电气性能的同时，提高成本效益。其中包括利用成熟的多层电路板（MLPCB）技术（集成了无源元件），与多芯片RF功能模块集成。分析模型与测试数据之间的相关性。这种设计方法所提供的集成度和多功能性的提高，可以潜在地节省功能模块的质量，尺寸和成本。该技术使用集总元件和分布式元件传输线方法的组合来表征多层印刷电路板（MLPCB）内的电路元件和层间过渡，其属性被开发为覆盖较宽的工作频带。该模型还包括处理技术，互连和3D RF集成拓扑的影响（例如：封装表面安装附接过程，引线键合互连和通过过渡的多层宽带RF）。所开发的等效电路模型解决了MMIC封装/ MLPCB组件的射频，机械和加工属性，以得出适用于广泛应用的设计参数。等效电路模型进一步得到了测量结果的验证。迄今为止，该模型已针对不同的宽带有源和无源微波网络进行了验证。

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  • 来源
  • 会议地点 San Jose CA(US)
  • 作者

    Arvind Swarup; Dave Davitt; Ian Christison;

  • 作者单位

    Com Dev Ltd., Space Electronics and Instruments Business Unit 155 Sheldon Drive, Cambridge, Ontario, Canada arvind.swarup@comdev.ca;

    Com Dev Ltd., Space Electronics and Instruments Business Unit 155 Sheldon Drive, Cambridge, Ontario, Canada,dave.davitt@comdev.ca;

    Com Dev Ltd., Space Electronics and Instruments Business Unit 155 Sheldon Drive, Cambridge, Ontario, Canada,Ian.Christison@comdev.ca;

  • 会议组织
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 微电子学、集成电路（IC）;
  • 关键词

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