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首页> 外文会议>IMAPS 40th international symposium on microelectronics >2~nd and 3~rd Level Solder Joint Reliability of High-end Flip Chip System in Package (SiP)
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2~nd and 3~rd Level Solder Joint Reliability of High-end Flip Chip System in Package (SiP)

机译：封装中高端倒装芯片系统的第二级和第三级焊点可靠性

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摘要

The major concerns posed by System in Package (SiP) design for network applications are the interconnection reliability between memory Plastic Ball Grid Array (PBGA) package and SiP module which we refer to 2~nd level interconnection, and between SiP module and the system board which we refer to 3~rd level interconnection, induced by thermomechanical stress to the large SiP module like 55x55sqmm package body size. In this paper, the Finite Element Analysis (FEA) and Design of Experiment (DOE) case studies were used to evaluate the 2803pin Flip Chip SiP (FCSiP) and to determine the best construction of SiP module and optimize the assembly material set. Heat spreader (Lid) thickness, heat spreader material, and underfill implementation were considered in the stress and fatigue lifetime FEA case studies and long-term solder joint reliability, which is Accelerated Thermal Cycle (ATC) tested at 0~100ºC operating temperature. rnAnother important factor in the system level reliability is an external heat sink and its compressive force effect was also investigated in the ATC test. In addition, short-term mechanical reliability tests, such as 4 point monotonic bend test based on IPC-9702 spec and mechanical shock test based on JEDEC standard, were also evaluated for the 2803pin FCSiP qualification. Finally, the actual results of the experiments were compared with the FEA data in a correlation process.
机译：系统级封装（SiP）设计为网络应用带来的主要问题是存储器塑料球栅阵列（PBGA）封装与SiP模块之间的互连可靠性（我们称为第二级互连）以及SiP模块与系统板之间的互连可靠性我们将其称为第三级互连，这是由热机械应力导致的大型SiP模块（如55x55sqmm封装尺寸）引起的。在本文中，有限元分析（FEA）和实验设计（DOE）案例研究用于评估2803pin倒装芯片SiP（FCSiP）并确定SiP模块的最佳构造并优化组装材料集。在应力和疲劳寿命FEA案例研究以及长期焊点可靠性中考虑了散热器（盖）的厚度，散热器材料和底部填充的实现，这是在0〜100ºC的工作温度下进行的加速热循环（ATC）测试。 rn影响系统级可靠性的另一个重要因素是外部散热器，并且在ATC测试中还研究了其压缩力效应。此外，还评估了短期机械可靠性测试，例如基于IPC-9702规范的4点单调弯曲测试和基于JEDEC标准的机械冲击测试，以测试2803pin FCSiP的资格。最后，在相关过程中将实验的实际结果与FEA数据进行比较。

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