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Physical Design Developments and Challenges for High-Performance Processors

机译:高性能处理器的物理设计发展与挑战

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摘要

This presentation will focus on the mechanical and thermal challenges that face x86 microprocessors that are the foundation of the personal computer market. The presentation will look at technical and market trends based on past products and outline developments and challenges that will be faced for future products. The personal computer market will be reviewed. The personal computer market has segmented into many different markets - consumer, commercial, and high performance - and form factors -desktop (ATX/μATX), small form factor, mobile, and server/workstation - based on x86 microprocessors. The presentation will focus on the desktop and mobile form factors. The power dissipation of early to current x86 microprocessors, along with the packaging constructions, will be compared. Over this same period, the evolution of thermal interface materials, heat sinks, sockets, fans and system-form factors will be discussed. This review will serve to look at whether the current trends are technically maintainable and to outline innovations that will be required. This review coupled with the market review above will be utilized to outline one set of possible thermal and mechanical challenges that engineers will face in the future.
机译:本演讲将重点讨论作为个人计算机市场基础的x86微处理器所面临的机械和热方面的挑战。演讲将基于过去的产品,探讨技术和市场趋势,并概述未来产品将面临的发展和挑战。个人计算机市场将受到审查。个人计算机市场已细分为许多不同的市场-消费类,商用和高性能-以及基于x86微处理器的台式机(ATX /μATX),小型机,移动设备和服务器/工作站。该演讲将重点关注台式机和移动设备的外形尺寸。将比较早期x86微处理器的功耗以及封装结构。在同一时期,将讨论热界面材料,散热器,插座,风扇和系统形式因素的发展。这项审查将有助于研究当前趋势在技术上是否可维护,并概述所需的创新。这次审查与上面的市场审查一起将用于概述工程师将来将面临的一组可能的热和机械挑战。

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