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VGA 17 μm development for compact, low-power systems

机译：VGA 17μm开发，用于紧凑型低功耗系统

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摘要

The high level of accumulated expertise by ULIS and CEA/LETI on uncooled microbolometers made from amorphous silicon has enabled ULIS to develop VGA IRFPA formats with 17 μm pixel-pitch, hence building up the currently available product catalog. This detector keeps all the innovations developed on the 25 μm pixel-pitch ROIC (detector configuration by serial link, low power consumption and wide electrical dynamic range). The specific appeal of this unit lies in the high spatial resolution it provides. The pixel-pitch reduction turns this TEC-less VGA array into a product well adapted for high resolution and compact systems. Electro-optical performances of this IRFPA are presented hereafter as well as recent performance improvement. We will focus on NETD trade-off with wide thermal dynamic range, as well as the high characteristics uniformity and pixel operability, achieved thanks to the mastering of amorphous silicon technology coupled with the ROIC design. Solar exposure is also taken into account and shows that ULIS amorphous silicon is perfectly well suited to sustain high intensity exposure. This technology node associated with advanced packaging technique paves the way to compact low power system.
机译：ULIS和CEA / LETI在由非晶硅制成的非制冷测微计上积累了丰富的专业知识，这使ULIS能够开发像素间距为17μm的VGA IRFPA格式，从而建立了当前可用的产品目录。该检测器保留了25μm像素间距ROIC（通过串行链路配置的检测器配置，低功耗和宽动态范围）的所有创新。该单元的特别魅力在于它提供的高空间分辨率。像素间距的减小将这种无TEC的VGA阵列变成了非常适合高分辨率和紧凑型系统的产品。下文介绍此IRFPA的电光性能以及最近的性能改进。我们将重点关注具有宽动态范围的NETD权衡，以及通过掌握非晶硅技术和ROIC设计而实现的高特性均匀性和像素可操作性。还考虑了日光照射，这表明ULIS非晶硅非常适合维持高强度照射。与先进封装技术相关的技术节点为紧凑型低功耗系统铺平了道路。

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