Measurement method for failure prognosis in lead-free interconnections

机译：无铅互连中故障预测的测量方法

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The specification of a reliability criterion for solder joints is an important element in the qualification of an electronic product, in particular for the new lead-free alloys. A common approach to reliability evaluation for soldering is to monitor electrical resistance after, or better during, the testing. The techniques employed for DC resistance monitoring will capture information regarding transients or long-term drift. This paper reviews and assesses the DC resistance monitoring during reliability testing of lead-free solder material used for the implementation of an ultrasound transducer. An experimental study on a transducers implemented with soldering made up by In-Sn was performed to compare reliability performance with Sn-Pb soldering and measurement techniques. Moreover we would propose to use a method for failure prognosis, considering measurements with changes of frequency, in order to evaluate the possibility to identify the failure occurrence earlier than the DC resistance.

机译：焊点可靠性标准的规范是电子产品认证中的重要元素，尤其是对于新型无铅合金。评估焊接可靠性的常用方法是在测试之后或测试期间更好地监测电阻。用于直流电阻监视的技术将捕获有关瞬变或长期漂移的信息。本文回顾并评估了用于超声换能器的无铅焊料材料可靠性测试期间的直流电阻监控。对由In-Sn制成的焊接实现的换能器进行了实验研究，以比较Sn-Pb焊接和测量技术的可靠性。此外，我们建议使用一种故障预测方法，考虑频率变化的测量，以便评估比直流电阻更早识别故障发生的可能性。

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《Instrumentation and Measurement Technology Conference (I2MTC), 2012 IEEE International》|2012年|p.483- 487|共5页
会议地点 Graz(AT)
作者
Catelani Marcantonio; Scarano Valeria L.;
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Department of Electronics and Telecommunications, University of Florence, via S. Marta 3, 50139, Firenze, Italy;

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原文格式 PDF
正文语种 eng
中图分类计量学;
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Measurement method for failure prognosis in lead-free interconnections

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