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RF MEMS packaging based on LTCC technology and applications

机译：基于LTCC技术和应用的RF MEMS封装

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Low Temperature Cofired Ceramics (LTCC) has been a popular multi-layer ceramic (MCM) packaging material for many electronic applications. The main advantage with LTCC would be its ability to embed a major part of the electronic circuit within itself, apart from its enhanced RF functionality as against many lossy materials used. The advantages of LTCC in terms of frequency response, cost, ease of fabrication, etc. over many other packaging materials are presented. The applicability of LTCC as a packaging material, circuit mounting material, substrate material or a base material for micro devices is discussed. Low temperature co-fired ceramics (LTCC) is a key technology assets for MEMS/ MOEMS/RF-MEMS packaging. The tolerance of device alignment is the key issue of integration. In order to be able to use mass-manufacturing tools, the primary aim is to process 3D structures, such as, grooves, cavities, holes, bumps and alignment fiducials, which can be used for the passive alignment of devices. The tolerances of LTCC structures are typically ±5μm and in some specific cases ±2μm. Thermal management by the use of thermal vias in LTCC is a well-established technique, and liquid cooling channels in the LTCC substrate provide efficient additional means for high-power laser cooling. When targeting for thermally controlled systems, thermal bridge structures can be used to isolate critical devices from main structures. LTCC provides inherently hermetic substrate allowing for the possibility to hermetic encapsulation. Hermetic fiber feed throughs and transparent windows can be integrated in LTCC structures. Cavities, channels and sealed gas cells can be fabricated, also. RF antennas and coil structures for electro-magnetic field control can be integrated in the LTCC substrate. Therefore, 3D packaging of MEMS and RF MEMS is enabled by LTCC.
机译：低温共烧陶瓷（LTCC）已成为许多电子应用中流行的多层陶瓷（MCM）包装材料。 LTCC的主要优势在于它能够将电子电路的主要部分嵌入其内部，这是因为它具有增强的RF功能（与使用的许多有损耗材料相对）。提出了LTCC在频率响应，成本，易于制造等方面优于许多其他包装材料的优势。讨论了LTCC作为包装材料，电路安装材料，基板材料或微型设备基材的适用性。低温共烧陶瓷（LTCC）是MEMS / MOEMS / RF-MEMS封装的关键技术资产。设备对准的公差是集成的关键问题。为了能够使用批量制造工具，主要目的是处理3D结构，例如凹槽，空腔，孔，凸点和对准基准，这些3D结构可用于设备的被动对准。 LTCC结构的公差通常为±5μm，在某些特定情况下为±2μm。通过在LTCC中使用热过孔来进行热管理是一项行之有效的技术，并且LTCC基板中的液体冷却通道为大功率激光冷却提供了有效的附加手段。当针对热控制系统时，热桥结构可用于将关键设备与主要结构隔离。 LTCC提供了固有的密封基板，从而可以进行密封。密封的纤维穿通孔和透明窗口可以集成在LTCC结构中。也可以制造腔，通道和密封的气室。用于电磁场控制的RF天线和线圈结构可以集成在LTCC基板中。因此，LTCC支持MEMS和RF MEMS的3D封装。

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