Thermal Modeling and Experimental Validation of Heat Sink Design for Passive Cooling of BEOL IC Structures

机译：BEOL IC结构被动冷却散热器设计的热建模和实验验证

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Reducing the operating temperature of microelectronic devices is crucial for increasing reliability and extending lifetime. This study presents a proposed embedded heat sink design for passive cooling of BEOL interconnects and IC structures. Sample devices are fabricated and tested using thermoreflectance thermography to characterize the thermal response of the devices and assess the added cooling effects of the heat structures. An experimentally validated thermal model is built to analyse the thermal performance of the device and extract the thermal parameters of the structure.

机译：降低微电子设备的工作温度对于提高可靠性和延长使用寿命至关重要。这项研究提出了一种用于BEOL互连和IC结构的被动冷却的嵌入式散热器设计。使用热反射热成像技术制造并测试样品设备，以表征设备的热响应并评估热结构带来的额外冷却效果。建立了经过实验验证的热模型，以分析设备的热性能并提取结构的热参数。

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来源
《International Workshop on Thermal Investigations of ICs and Systems》|2018年|1-3|共3页
会议地点 Stockholm(SE)
作者
Assaad El Helou; Peter E. Raad; Dhishan Kande; Archana Venugopal;
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作者单位

Mechanical Engineering Department Southern Methodist University Dallas Texas 75275 USA;

Texas Instruments Incorporated Dallas Texas 75243 USA;

Texas Instrum;

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原文格式 PDF
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关键词
Heat sinks; Integrated circuit modeling; Thermal resistance; Resistance heating; Thermal conductivity; Temperature measurement;

机译：散热片;集成电路建模；热阻;电阻加热；导热系数;温度测量;

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3. Standardized Heat Spreader Design for Passive Cooling of Interconnects in the BEOL of ICs [J] . El Helou Assaad, Venugopal Archana, Raad Peter E. Components, Packaging and Manufacturing Technology, IEEE Transactions on . 2020,第6期

机译：标准化散热器设计，用于IC的BEOL中的互连被动冷却
4. Thermal Modeling and Experimental Validation of Heat Sink Design for Passive Cooling of BEOL IC Structures [C] . Assaad El Helou, Peter E. Raad, Dhishan Kande, International Workshop on Thermal Investigations of ICs and Systems . 2018

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机译：最优无源冷却散热器设计的热性能分析

Thermal Modeling and Experimental Validation of Heat Sink Design for Passive Cooling of BEOL IC Structures

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