首页> 外文会议>International Conference on Copper 2003-Cobre 2003 v.6 book 1; 20031130-20031203; Santiago; CL >Mechanism and kinetics of chalcopyrite passivation during bacterial leaching
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Mechanism and kinetics of chalcopyrite passivation during bacterial leaching

机译:黄铜矿浸出过程中黄铜矿钝化的机理和动力学

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Electrochemical measurements using a chalcopyrite electrode, coupled with chemical leaching experiments, were used to study the interactions between chalcopyrite leaching, temperature, Fe in solution and surface modifications. Leaching of chalcopyrite presented two-stage kinetics: an induction period and a linear kinetics. The induction period decreased with increasing temperature. It was found that chalcopyrite dissolution was accelerated at high temperature and low potentials. The results showed that chalcopyrite passivation can be explained by two different mechanisms. At low temperature and low potentials the leaching rate seems to be retarded by the formation of a copper-rich polysulphide. A ratio of dissolved copper to iron of 1:3 was obtained at a constant potential of 0.450 V vs SCE. The leaching rate also decreases at high temperature and high potentials, possibly due to the precipitation of ferric ions that hydrolyze to form iron-hydroxy compounds. There was a good agreement between electrochemical data and the results of chemical leaching tests.
机译:使用黄铜矿电极进行电化学测量,再结合化学浸出实验,研究了黄铜矿浸出,温度,溶液中的铁和表面改性之间的相互作用。黄铜矿的浸出呈现两个阶段的动力学:诱导期和线性动力学。诱导期随温度升高而降低。发现在高温和低电势下黄铜矿溶解被加速。结果表明,黄铜矿钝化可以用两种不同的机理来解释。在低温和低电势下,浸出速率似乎由于富铜多硫化物的形成而受到阻碍。在0.450 V vs SCE的恒定电势下,铜和铁的溶解比为1:3。在高温和高电势下,浸出速率也会降低,这可能是由于水解形成铁-羟基化合物的三价铁离子沉淀所致。电化学数据与化学浸出试验的结果之间有很好的一致性。

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