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首页> 外文会议>International Conference on Embedded Software and Systems(ICESS 2005); 20051216-18; Xi'an(CN) >The Design Space of CMP vs. SMT for High Performance Embedded Processor
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The Design Space of CMP vs. SMT for High Performance Embedded Processor

机译：高性能嵌入式处理器的CMP与SMT的设计空间

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摘要

In embedded world, many researchers have begun to examine Simultaneous Multithreading (SMT) and Chip Multiprocessing (CMP) for various demands. SMT and CMP both make a chip to achieve greater throughput. But the power, chip size and thermal features are also important for embedded system. In this paper we compare the design space of both architecture. As simulation results shown, although extending wide-issue processor into SMT has the advantage of small design changes, high hardware resource efficiency and high throughput, CMP presents better scalability in raw performance and power metric under heavy multithreaded workload than SMP. CMP integrates several similar processor in a single chip, so it can't uses the chip area efficiently like SMT. And the chip area limits will prevent the CMP from equipping a large L2 cache, which will hurt the performance of memory-bound application. The evaluation also points out the design problem and possible solution for power, chip size and thermal efficiency in CMP and SMT.
机译：在嵌入式世界中，许多研究人员已开始针对各种需求研究同步多线程（SMT）和芯片多处理（CMP）。 SMT和CMP都使芯片达到更高的吞吐量。但是功率，芯片尺寸和散热特性对于嵌入式系统也很重要。在本文中，我们比较了两种架构的设计空间。如仿真结果所示，尽管将广泛发布的处理器扩展到SMT具有设计变更小，硬件资源效率高和吞吐量高的优势，但是在多线程工作量繁重的情况下，CMP在原始性能和功耗指标方面具有比SMP更好的可伸缩性。 CMP在单个芯片中集成了多个类似的处理器，因此无法像SMT那样有效地利用芯片面积。并且芯片面积限制将阻止CMP配备大型L2缓存，这将损害内存绑定应用程序的性能。评估还指出了CMP和SMT中功率，芯片尺寸和热效率的设计问题和可能的解决方案。

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