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首页> 外文会议>国际断裂力学2009年会 >Creep constitutive relations and creep mechanism of Ag particle enhancement Sn-0.7Cu based composite solder joints
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Creep constitutive relations and creep mechanism of Ag particle enhancement Sn-0.7Cu based composite solder joints

机译：Ag颗粒增强Sn-0.7Cu基复合焊点的蠕变本构关系和蠕变机理

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In the paper,a novel equipment of high temperature creep strain test was used for testing materials used in the micro-electronic technology and solder joints.Based on the Dorn Equation,measurements were conducted on Ag particle enhancement Sn-0.7Cu based composite solder joints for confirming the creep parameters,i.e.,stress exponent,activation energy and constant A.The final constitutive equation for the solder joints was established.The creep mechanism of the Ag particle enhancement Sn-0.7Cu based composite solder joints is studied.Results show that the exponents of the composite solder joints can be divided into two regions by stress:low stress region and high stress region and the stress exponents at low stress region are all more than those at high stress region at the same temperature.The stress exponents of two regions demonstrate an increasing trend as the temperature decreases under the same stress,which indicates that creep resistance is more obvious at lower temperature.The average creep activation energy at low stresses is larger than that at high stresses and the absolute values of the activation energies take an increasing trend with stress decreasing at the same temperature,which indicates that creep resistance is more obvious at lower stresses.At the same time,the dislocation climbing of the Ag particle enhancement Sn 0.7Cu based composite soldered joint was dominated by the lattice self-diffusion process under high temperature and low stress and dominated by the dislocation pipe diffusion process under low temperature and high stress.
机译：本文采用一种新型的高温蠕变应变试验设备对微电子技术和焊点材料进行了测试。基于Dorn方程，对Ag颗粒增强Sn-0.7Cu基复合焊点进行了测量。为确定蠕变参数，即应力指数，活化能和常数A，建立了焊点的最终本构方程。研究了Ag颗粒增强Sn-0.7Cu基复合焊点的蠕变机理。在相同温度下，复合焊点的应力指数可分为两个区域：低应力区域和高应力区域，在相同温度下低应力区域的应力指数都大于高应力区域的应力指数。两个应力指数在相同的应力下，随着温度的降低，这些区域表现出增加的趋势，这表明在较低的温度下，抗蠕变性更加明显。在相同温度下，低应力下的平均蠕变活化能大于高应力下，并且活化能的绝对值随应力的减小而呈增加趋势，这表明在较低应力下，蠕变抗力更加明显。结果表明，Ag颗粒增强Sn 0.7Cu基复合钎料的位错爬升主要由高温低应力下的晶格自扩散过程主导，而在低温高应力下由位错管扩散过程主导。

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