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首页> 外文会议>International Conference on Processing amp; Manufacturing of Advanced Materials Pt.4; Jul 7-11, 2003; Leganes, Madrid, Spain >Texture, Microstructure and Stress Investigations in 0.18 μm Damascene Cu Interconnect Lines
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Texture, Microstructure and Stress Investigations in 0.18 μm Damascene Cu Interconnect Lines

机译：0.18μm镶嵌铜互连线的织构，微观结构和应力研究

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摘要

Texture, microstructure and stresses were investigated in 0.18 μm damascene Cu interconnect lines. Additionally, for purpose of comparison, the same parameters were investigated in 0.25 μm, 2 μm damascene Cu lines and Cu blanket film. Measurements were done using x-ray diffraction (XRD) and orientation imaging microscopy (OIM). Both macro and microtexture were characterized by computing the orientation distribution functions (ODFs) and inverse pole figures. Microstructure was characterized by computing - unique grain color maps, mean grain size and coincident site lattice (CSV) boundary distribution. Stresses were measured by XRD using sin~2ψ method.
机译：在0.18μm的金属铜互连线中研究了织构，微观结构和应力。此外，出于比较的目的，在0.25μm，2μm的大马士革Cu线和Cu覆盖膜中研究了相同的参数。使用X射线衍射（XRD）和定向成像显微镜（OIM）进行测量。宏观和微观纹理都通过计算取向分布函数（ODF）和反极图形来表征。通过计算来表征微观结构-独特的晶粒颜色图，平均晶粒尺寸和重合的晶格（CSV）边界分布。用sin〜2ψ法通过XRD测量应力。

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