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首页> 外文会议>International electronics manufacturing technology symposium : Manufacturing technologies-present and future >High-Density Build-Up Wiring Boards Using Conventional Printed Wiring Boards Process
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High-Density Build-Up Wiring Boards Using Conventional Printed Wiring Boards Process

机译：使用常规印刷线路板工艺的高密度积层线路板

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To Keep pace with the downsizing of electronic communication equipments and acceleration of transmission speed, the printed wiring board (PWB) must have finer wiring and thinner plating. While various means have been developed to produce these high density boards,we have also developed a process that enabling the production of upper and lower surface conductor interconnection on Build-Up substrates using metallic via-posts.rnThe features of the via-post type boards are as follows : a) it is possible to make them high density .because of very small via-post developed; b) Any type of resin can be used; c) Stacks are possible; that is,mounting a post directly above another post; d) wirebonding to pad is possible by use of via-post.rnWe developed high density, high quality, lower costing, and easier to enable via-post type Build-Up PWBs for Card PCs using conventional PWBs equipments. The following is a report on our investigation and the result of trial PWBs evaluations.
机译：为了跟上电子通信设备的小型化和传输速度的加快，印刷线路板（PWB）必须具有更细的布线和更薄的镀层。尽管已开发出各种方法来生产这些高密度板，但我们还开发了一种工艺，该工艺能够使用金属通孔在积层基板上生产上下表面导体互连。rn通孔型板的功能如下：a）可以使它们具有高密度。 b）可以使用任何类型的树脂； c）可以叠放；也就是说，将一个帖子直接安装在另一个帖子的上方； d）通过使用通孔接线柱可以将其引线键合到焊盘上。我们开发了高密度，高质量，低成本的产品，并且使用传统的PWB设备，更易于实现用于Card PC的通孔接线柱式构建PWB。以下是关于我们的调查和试验性PWB评估结果的报告。

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