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首页> 外文会议>International Symposium on Hydrogen at Surface and Interfaces, May, 2000, Toronto >CHELATING AGENT EFFECTS ON HYDROGEN INCORPORATION IN THE ELECTRODEPOSITION OF Au-Cu
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CHELATING AGENT EFFECTS ON HYDROGEN INCORPORATION IN THE ELECTRODEPOSITION OF Au-Cu

机译：Au-Cu电沉积中氢结合的螯合剂作用

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摘要

A comparison of EDTA and DTPA as chelating agents for Cu~(2+) in cyanide-free electroforming baths is reported. The research is based on quantitative analyses of embedded hydrogen content (LECO thermal desorption spectroscopy), electrochemical (LSV, RDE, potentiostatic transients), mechanical (recording hardness and tensile testing), structural (XRD) and compositional (EDS, XRF) measurements. DTPA gives the possibility of incorporating lower amounts of hydrogen into a low-temperature trap from which it can be desorbed by a simple heat-treatment. EDTA gives rise to hydrogen entrapment also in a high-temperature trap, from which it can be removed by heat-treatments which damage the material. Since hydrogen present into a high-temperature trap gives rise to the formation of nanovoids, defect-dependent mechanical properties (such as Young modulus and plastic flow) are better for alloys from DTPA than EDTA baths. The former alloys also show lower twinning fault densities. Both baths display an acceptable range of current densities in which 18 kt Au deposits can be obtained, this is important for the electroforming of jewels with possibly complex shapes.
机译：报道了EDTA和DTPA作为无氰电铸浴中Cu〜（2+）螯合剂的比较。该研究基于对嵌入式氢含量（LECO热脱附光谱法），电化学（LSV，RDE，恒电位瞬变），机械（记录硬度和拉伸测试），结构（XRD）和成分（EDS，XRF）测量的定量分析。 DTPA可以将较少量的氢气引入低温阱中，通过简单的热处理即可将其解吸。 EDTA也会在高温阱中引起氢​​气截留，可以通过热处理将其除去，从而损坏材料。由于存在于高温阱中的氢会形成纳米孔，因此与EDTA镀液相比，DTPA合金的缺陷相关机械性能（例如杨氏模量和塑性流动）更好。前者的合金还显示出较低的孪生断层密度。两个镀液均显示出可接受的电流密度范围，在该范围内可获得18 kt的金沉积物，这对于形状复杂的珠宝首饰的电铸非常重要。

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