首页> 外文会议>International Symposium on Metastable and Nano-Materials(ISMANAM-2005); 20050703-07; Paris(FR) >Formation of high-strength nano-micro duplex structures in electrodeposited Ni-based alloys
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Formation of high-strength nano-micro duplex structures in electrodeposited Ni-based alloys

机译:电沉积镍基合金中高强度纳米微双相结构的形成

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摘要

Nanocrystalline Ni-W electrodeposits with finely dispersed micrometer sized array holes have been prepared using the UV-lithographic technologies. Tensile stress and the total elongation at fracture of the monolithic Ni-16 at.% W nanocrystalline alloys in the grain size range of 5-10 nm attained to 1700 MPa and about 1%, respectively, and that of the Ni-W nanocrystalline alloys with finely dispersed array holes having diameter of 30 μm with regular intervals of 100 μm increased to maximum values of 2200 MPa and about 1.2%, respectively.
机译:使用紫外光刻技术已经制备了具有精细分散的微米级阵列孔的纳米晶Ni-W电沉积物。整体尺寸为5-10 nm的单片Ni-16 at。%W纳米晶合金的拉伸应力和断裂总伸长率分别为1700 MPa和约1%,而Ni-W纳米晶合金为直径为30μm,规则间隔为100μm的细分散阵列孔的最大值分别增加到2200 MPa和约1.2%。

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