首页> 外文会议>International Symposium on Metastable and Nano-Materials(ISMANAM-2005); 20050703-07; Paris(FR) >Surface modification of Ni (50.6 at.) Ti by high current pulsed electron beam treatment
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Surface modification of Ni (50.6 at.) Ti by high current pulsed electron beam treatment

机译:高电流脉冲电子束处理Ni(50.6 at。%)Ti的表面改性

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摘要

A Ni (50.6 at.%) Ti shape memory alloy having a grain size of 30-50μm, was subjected to high current pulsed electron beam (HCPEB) irradiation and the microstructure modifications were investigated in detail. The treatment induces superfast melting and solidification at the top surface. As a result, the top surface melted layer solidified into a 600 nm fine grain austenite (B2) structure. A martensitic phase transformation occurred in the subsurface zone due to the high thermal stress induced by the HCPEB treatment. This transformation was avoided in the top surface melted layer.
机译:对具有30-50μm晶粒尺寸的Ni(50.6 at。%)Ti形状记忆合金进行大电流脉冲电子束(HCPEB)照射,并详细研究了显微组织的变化。该处理在顶面引起超快的熔化和固化。结果,上表面熔融层凝固成600nm的细晶粒奥氏体(B2)结构。由于HCPEB处理引起的高热应力,在地下区域发生了马氏体相变。在上表面熔融层中避免了这种转变。

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