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首页> 外文会议>International Workshop on Advanced Metallic Materials and Processing Techniques for Aeronautical Applications; 20051118-20; Nanjing(CN) >Jet electrodeposition oriented by rapid prototyping
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Jet electrodeposition oriented by rapid prototyping

机译：通过快速原型设计进行喷射电沉积

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摘要

The system components and the theory of jet electrodeposition orientated by rapid prototyping (RP) were introduced. The nanocrystalline copper parts with simple shape were fabricated by this rapid prototyping technology. The microstructure evolution of the nanocrystalline copper layer was examined by means of the scanning electron microscopy and X-ray diffraction. The results show that the jet electrodeposition can greatly enhance the limited current density, fine crystalline particles and improve deposition quality. The copper deposited layers have nanocrystalline microstructure with average size of 55.6 nm. The grain size decreases to 41.4 nm on crystal plane (311).
机译：介绍了通过快速原型（RP）定向的系统组件和喷射电沉积理论。通过这种快速成型技术可以制造出形状简单的纳米晶铜零件。通过扫描电子显微镜和X射线衍射检查了纳米晶铜层的微观结构演变。结果表明，喷射电沉积可以大大提高有限的电流密度，细小的晶体颗粒并改善沉积质量。铜沉积层具有平均尺寸为55.6nm的纳米晶体微观结构。在晶面（311）上，晶粒尺寸减小到41.4nm。

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