Copper matrix composites reinforced respectively with nano-SiO_2 and nano-AlN particles

机译：纳米SiO_2和纳米AlN颗粒分别增强的铜基复合材料

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Two kinds of copper matrix composites reinforced respectively with nano-SiO_2 and nano-AlN were prepared by powder metallurgy technique. The microstructure and properties of the composites were studied. The results show that the nano-SiO_2 and nano-AlN distribution are uniform and the particulates also refine the grains. With the increase of nano-SiO_2 and nano-AlN addition, the density of the both composites decreases, the resistivity increases, whereas the value of hardness reaches the maximum. Softening temperature of the two kinds of composites are above 700℃ which is very high in comparison with pure copper (about 400℃). But with the same content of nano-SiO_2 and nano-AlN particles, the hardness of Cu/AlN is much higher than that of Cu/SiO_2, and the resistivity of Cu/AlN is close to that of Cu/SiO_2. Thus the reinforcement effect of nano-AlN is better than that of nano-SiO_2.

机译：通过粉末冶金技术制备了分别用纳米SiO_2和纳米AlN增强的两种铜基复合材料。研究了复合材料的微观结构和性能。结果表明，纳米SiO_2和纳米AlN分布均匀，并且颗粒也使晶粒细化。随着纳米SiO_2和纳米AlN添加量的增加，两种复合材料的密度降低，电阻率增加，而硬度值达到最大值。两种复合材料的软化温度均高于700℃，与纯铜（约400℃）相比非常高。但是在相同含量的纳米SiO_2和纳米AlN颗粒的情况下，Cu / AlN的硬度远高于Cu / SiO_2，并且Cu / AlN的电阻率接近于Cu / SiO_2。因此，纳米AlN的增强效果优于纳米SiO_2。

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来源
《International Workshop on Advanced Metallic Materials and Processing Techniques for Aeronautical Applications; 20051118-20; Nanjing(CN)》|2005年|P.132-135|共4页
会议地点 Nanjing(CN)
作者
Wu Yu-cheng; Wang Tu-gen; Wang Feng-tao; Ren Rong; Wang Wen-fang;
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作者单位

School of Materials Science and Engineering, Hefei University of Technology, Hefei 230009, China;

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会议组织
原文格式 PDF
正文语种 eng
中图分类金属材料;
关键词
powder metallurgy; composite; nano-particle; resistivity; hardness; softening temperature;

机译：粉末冶金;复合材料;纳米粒子;电阻率;硬度;软化温度;

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Copper matrix composites reinforced respectively with nano-SiO_2 and nano-AlN particles

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