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首页> 外文会议>Laser Applications in Microelectronic and Optoelectronic Manufacturing III >Laser cleaning of silicon surfaces
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Laser cleaning of silicon surfaces

机译：激光清洗硅表面

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Abstract: The continuing trend towards miniaturization of integrated circuits requires increasing efforts and new concepts to clean wafer surfaces from dust particles. We report here about our studies of the `steam laser cleaning' process first described by Tam and coworkers. In order to remove submicron particles from a surface, first a thin liquid layer is condensed onto the substrate from the gas phase, and is subsequently evaporated momentarily by irradiating the surface with a short laser pulse. We have investigated the nucleation and growth of gas bubbles in the liquid, by which the whole process is started, with optical techniques like light scattering and surface plasmon resonance spectroscopy. The experiments indicate that the temperature where nucleation sets in is surprisingly low, which facilitates the application of this phenomenon for cleaning purposes. On the basis of these results and in order to study the cleaning effect for the particularly interesting surface of silicon in a quantitative way, we have deposited well-characterized spherical polymer and silica particles of different diameters from several ten to hundred nanometers on commercial Si wafers and have studied systematically the cleaning efficiency of the explosive evaporation process. The results show that steam laser cleaning is a promising and suitable method for removing sub-micron particles from semiconductor surfaces.!26
机译：摘要：集成电路小型化的持续趋势要求加大工作量和采用新概念来清洁晶片表面上的灰尘颗粒。我们在此报告有关Tam和同事首先描述的“蒸汽激光清洁”过程的研究。为了从表面除去亚微米颗粒，首先将薄的液体层从气相凝结在基板上，然后通过用短激光脉冲照射表面将其瞬间蒸发。我们已经使用诸如光散射和表面等离振子共振光谱之类的光学技术研究了液体中气泡的形核和生长，由此开始了整个过程。实验表明，形核进入的温度出奇地低，这有利于将该现象用于清洁目的。基于这些结果，为了定量研究特别有趣的硅表面的清洁效果，我们在商业化的硅晶片上沉积了表征良好的球形聚合物和直径从几十到几百纳米的二氧化硅颗粒并且系统地研究了爆炸蒸发过程的清洁效率。结果表明，蒸汽激光清洗是一种从半导体表面去除亚微米颗粒的有前途且合适的方法。26

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