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首页> 外文会议>Laser-based micro- and nanoprocessing IX >Design and Fabrication of Sub-wavelength Annular Apertures for Femtosecond Laser Machining
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Design and Fabrication of Sub-wavelength Annular Apertures for Femtosecond Laser Machining

机译：飞秒激光加工亚波长环形孔径的设计与制造

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Many research teams have begun pursuing optical micromachining technology in recent years due to its associated noncontact and fast speed characteristics. However, the focal spot sizes and the depth of focus (DOF) strongly influenced the design requirements of the micromachining system. The focal spot size determines the minimum features can be fabricated, which is inversely proportional to the DOF. That is, smaller focal spot size led to shorter DOF. However, the DOF of the emitted visible or near-infrared light beam is typically limited to tens of nanometers for traditional optic system. The disadvantages of using nanosecond laser for micromachining such as burrs formation and surface roughness were found to further influence the accuracy of machined surfaces. To alleviate all of the above-mentioned problems, sub-wavelength annular aperture (SAA) illuminated with 780 nm femtosecond laser were integrated to develop the new laser micromachining system presented in this paper. We first optimized the parameters for high transmittance associated with the SAA structure for the 780 nm femtosecond laser used by adopting the finite difference time domain simulations method. A lateral microscope was modified from a traditional microscope to facilitate the measurement of the emitted light beam optical energy distribution. To verify the newly developed system performance the femtosecond laser was used to illuminate the SAA fabricated on the metallic film to produce the Bessel light beam so as to perform micromachining and process on silicon, PCB board and glass. Experimental results were found to match the original system design goals reasonably well.
机译：近年来，由于其相关的非接触和快速特性，许多研究团队已开始追求光学微加工技术。但是，焦点尺寸和焦点深度（DOF）强烈影响了微加工系统的设计要求。焦点尺寸决定了可以制造的最小特征，其与自由度成反比。即，较小的焦点尺寸导致较短的DOF。然而，对于传统的光学系统，所发射的可见光束或近红外光束的自由度通常限于数十纳米。发现使用纳秒激光进行微加工的缺点，例如毛刺形成和表面粗糙度，会进一步影响加工表面的精度。为了缓解上述所有问题，集成了用780 nm飞秒激光照射的亚波长环形孔径（SAA），以开发本文提出的新型激光微加工系统。我们首先通过采用时域有限差分模拟方法优化了与780 nm飞秒激光器SAA结构相关的高透射率参数。侧向显微镜是对传统显微镜的改进，以方便测量发射光束的光能分布。为了验证新开发的系统性能，使用飞秒激光照射在金属膜上制造的SAA，以产生贝塞尔光束，从而对硅，PCB板和玻璃进行微加工和加工。实验结果与原始系统设计目标相当吻合。

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