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首页> 外文会议>Laser-based micro- and nanoprocessing IX >Laser Forward Transfer of Solder Paste for Microelectronics Fabrication
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Laser Forward Transfer of Solder Paste for Microelectronics Fabrication

机译：激光正向转移锡膏，用于微电子制造

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摘要

The progressive miniaturization of electronic devices requires an ever-increasing density of interconnects attached via solder joints. As a consequence, the overall size and spacing (or pitch) of these solder joint interconnects keeps shrinking. When the pitch between interconnects decreases below 200 μm, current technologies, such as stencil printing, find themselves reaching their resolution limit. Laser direct-write (LDW) techniques based on laser-induced forward transfer (LIFT) of functional materials offer unique advantages and capabilities for the printing of solder pastes. At NRL, we have demonstrated the successful transfer, patterning, and subsequent reflow of commercial Pb-free solder pastes using LIFT. Transfers were achieved both with the donor substrate in contact with the receiving substrate and across a 25 μm gap, such that the donor substrate does not make contact with the receiving substrate. We demonstrate the transfer of solder paste features down to 25 μm in diameter and as large as a few hundred microns, although neither represents the ultimate limit of the LIFT process in terms of spatial dimensions. Solder paste was transferred onto circular copper pads as small as 30 μm and subsequently reflowed, in order to demonstrate that the solder and flux were not adversely affected by the LIFT process.
机译：电子设备的逐步小型化要求通过焊点连接的互连的密度不断增加。结果，这些焊点互连的整体尺寸和间距（或间距）不断缩小。当互连之间的间距减小到200μm以下时，诸如模板印刷之类的当前技术会发现自己已达到其分辨率极限。基于功能材料的激光感应正向转移（LIFT）的激光直接写入（LDW）技术为焊膏的印刷提供了独特的优势和能力。在NRL，我们已经证明了使用LIFT成功地转移，图案化和随后回流了商用无铅锡膏。在施主基板与接收基板接触并且跨越25μm间隙的情况下都实现了转移，使得施主基板不与接收基板接触。我们展示了直径小于25μm且高达数百微米的焊膏特征的转移，尽管这两个都没有代表LIFT工艺的空间极限。锡膏被转移到直径为30μm的圆形铜焊盘上，然后回流，以证明LIFT工艺不会对焊料和助焊剂产生不利影响。

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