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2D OR NOT 2D, THAT IS THE QUESTION!

机译：二维还是非二维，这就是问题！

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We all know that the paste print process is the most unstablernelement in the SMT line. Arguably, this process contributesrnto 50-70% of the total defects seen during an SMT build.rnThe reason for this large variation is due to the number ofrnprocess parameters involved. It is generally accepted thatrnthere are about 35 variables to be controlled. Logically, ifrnwe could control this process through some form ofrninspection, then the defects seen at the end of the line couldrnbe greatly reduced.rnUsing AOI to inspect Solder Paste is becoming more andrnmore accepted by the Electronics Manufacturing Industry,rnhowever, what is the best approach to inspecting SolderrnPaste? Inspection incorporated into the screen printer itselfrnusing 2D or 3D options? Inspecting 2D or 3D after thernprinter with a stand-alone AOI system? Inspecting pasternafter the high-speed placement? Which is the better option:rn2D systems or 3D systems? Are combination 2D/3Drnapproaches better? This paper explores the differentrnpossibilities and comes up with some new and uniquernsolutions.
机译：我们都知道，粘贴印刷工艺是SMT生产线中最不稳定的因素。可以说，此过程占SMT构建期间看到的总缺陷的50-70％。之所以如此大的变化，是因为所涉及的过程参数数量众多。一般认为，大约有35个变量需要控制。从逻辑上讲，如果我们可以通过某种形式的检查来控制此过程，那么可以大大减少生产线末端出现的缺陷。使用AOI检查焊膏越来越被电子制造行业所接受，但是，最好的方法是什么检查SolderrnPaste？使用2D或3D选项将检查合并到丝网印刷机中吗？使用独立的AOI系统检查打印机后的2D或3D？高速贴装后检查pastern？哪个是更好的选择：rn2D系统或3D系统？ 2D / 3Drnapproach方法更好吗？本文探讨了各种可能性，并提出了一些新的独特解决方案。

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