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首页> 外文会议>Light-Emitting Diodes: Research, Manufacturing, and Applications XI; Proceedings of SPIE-The International Society for Optical Engineering; vol.6486 >Dicing of High-Power White LEDs in Heat Sinks with the Water Jet-Guided Laser
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Dicing of High-Power White LEDs in Heat Sinks with the Water Jet-Guided Laser

机译：水射流引导激光器将散热器中的高功率白光LED切成小方块

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摘要

High-brightness LEDs are compound semiconductor devices and distinguish themselves from conventional LEDs by their exceptional luminosity. Today they are increasingly used as light sources, replacing conventional incandescent and fluorescent lamp technologies. HB LEDs are difficult to manufacture, as they must be grown by sophisticated epitaxial growth techniques such as MOCVD. They are packaged like power semiconductors, using surface mount technology and thermal pads. After having been successfully applied to GaN scribing for side-emitting LEDs, the Laser MicroJet~R Is used today for cutting heat sinks of HB white LEDs. Due to the high-emitted light power, the generated heat must be dissipated through a heat sink. Materials typically employed are metals with high heat conductivity, notably CuW and molybdenum. Applying the Laser MicroJet~R, the achieved cutting quality in these metals is outstanding - smooth edges, no contamination, no burrs, no heat damage, no warping - all this at high speed.
机译：高亮度LED是复合半导体器件，并以其卓越的发光度与常规LED脱颖而出。如今，它们已越来越多地用作光源，取代了传统的白炽灯和荧光灯技术。 HB LED难以制造，因为它们必须通过复杂的外延生长技术（例如MOCVD）进行生长。它们使用表面贴装技术和散热垫像功率半导体一样进行封装。在成功应用于侧面发光LED的GaN划刻之后，Laser MicroJet〜R现在用于切割HB白色LED的散热器。由于高发射的光功率，产生的热量必须通过散热器散发。通常使用的材料是具有高导热率的金属，尤其是CuW和钼。使用Laser MicroJet〜R，在这些金属上可实现出色的切割质量-光滑的边缘，无污染，无毛刺，无热损伤，无翘曲-所有这些都是高速实现的。

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