Effect of High Temperature Aging on Microstructurual Evolution in AuSn Solder Joints

机译：高温时效对AuSn焊点组织演变的影响

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Eutectic AuSn solder is increasingly used in high temperature and high reliabilityrnapplications due to superior mechanical and thermal properties. These applications includernhybrid microelectronics, MEMS, high power laser diodes, optoelectronic devices andrncomponents packaging. Selection of appropriate device backside and substrate surfacernmetallization is critical for reliable soldering with AuSn, especially for high temperaturernapplication as diffusion accelerates at elevated temperature. A SiC die was used for die attachrnstudies on thick film metalized ceramic substrates. Two thick film metallurgies (Au and PtPdAu)rnwere evaluated. Aging and thermal cycling data are presented along with fracture surfacernanalysis after high temperature storage.

机译：由于优异的机械性能和热性能，共晶AuSn焊料越来越多地用于高温和高可靠性应用中。这些应用包括混合微电子，MEMS，高功率激光二极管，光电器件和组件封装。选择合适的器件背面和衬底表面金属化对于使用AuSn进行可靠的焊接至关重要，特别是对于高温应用，因为在高温下扩散会加速。 SiC芯片用于厚膜金属化陶瓷基板上的芯片附着研究。评价了两种厚膜冶金学（Au和PtPdAu）。高温存储后，将提供老化和热循环数据以及断裂表面分析。

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来源
《Materials science amp; technology 2011 conference amp; exhibition》|2011年|142-149|共8页
会议地点 Columbus OH(US)
作者
R. Zhang; R. W. Johnson; G. Muralidharan; D. Shaddock; T. Zhang;
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作者单位

Auburn University, Auburn, AL, USA;

Auburn University, Auburn, AL, USA;

Oak Ridge National Laboratory, Oak Ridge, TN, USA;

GE Global Research Center, Niskayuna, NY, USA;

GE Global Research Center, Niskayuna, NY, USA;

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原文格式 PDF
正文语种 eng
中图分类
关键词
High Temperature; AuSn Solder; Thick Film;

机译：高温;; AuSn焊料;;厚膜;

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1. 快速凝固对Sn-8Zn-3Bi合金特性及高温时效钎料/铜焊点结构演变的影响 [J] . 赵国际, 光华, 盛光敏中国有色金属学报（英文版） . 2017,第001期
2. 快速凝固对Sn-8Zn-3Bi合金特性及高温时效钎料/铜焊点结构演变的影响（英文） [J] . 赵国际, 文光华, 盛光敏中国有色金属学报：英文版 . 2017,第001期
3. 快速凝固对Sn-8Zn-3Bi合金特性及高温时效钎料/铜焊点结构演变的影响 [J] . 赵国际, 文光华, 盛光敏中国有色金属学报：英文版 . 2017,第001期
4. Microstructural evolution and shear performance of AuSn20 solder joint under gamma-ray irradiation and thermal cycling [J] . Li Wen, Songbai Xue, Liujue Wang, Journal of materials science . 2020,第9期

机译：γ20焊点下γ射线照射和热循环的微观结构演化与剪切性能
5. Microstructural evolution and shear strength of AuSn20/Ni single lap solder joints [J] . Xiao-feng Wei, Yu-kun Zhang, Ri-chu Wang, Microelectronics & Reliability . 2013,第5期

机译：AuSn20 / Ni单搭焊头的组织演变和剪切强度
6. Influence of temperature on the soldering process of CLCC-3 package components using AuSn20 solder [J] . Zhihuan Zhao, Guanghao Gong, Mingming Jiang, AIP Advances . 2020,第5期

机译：使用AUSN20焊料对CLCC-3包装组件焊接过程的影响
7. Effect of High Temperature Aging on Microstructurual Evolution in AuSn Solder Joints [C] . R. Zhang, R. W. Johnson, G. Muralidharan, Materials Science Technology Conference and Exhibition . 2011

机译：高温老化对AUSN焊点微结构演化的影响
8. Microstructural changes under isothermal aging and their influence on thermal fatigue reliability for tin-lead and lead-free solder joints, including microstructural changes under isothermal aging in mixed solder joints [D] . Choubey, Anupam 2007

机译：锡铅和无铅焊点在等温老化下的微观结构变化及其对热疲劳可靠性的影响，包括混合焊点在等温老化下的微观结构变化
9. Effect of Trace Zn Addition on Interfacial Evolution in Sn-10Bi/Cu Solder Joints during Aging Condition [O] . Qingfeng Wang, Hong Chen, Fengjiang Wang 2019

机译：微量锌对时效条件下Sn-10Bi / Cu焊点界面演变的影响
10. Influence of temperature on the soldering process of CLCC-3 package components using AuSn20 solder [O] . Zhihuan Zhao, Guanghao Gong, Mingming Jiang, 2020

机译：使用AUSN20焊料对CLCC-3包装组件焊接过程的影响

Effect of High Temperature Aging on Microstructurual Evolution in AuSn Solder Joints

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