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A novel thick film materials technology offering high performance packaging solutions

机译：一种新颖的厚膜材料技术，可提供高性能包装解决方案

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Thick film technology has been widely used in the past for modern performance packaging solutions, but has been unable to complete with thin film technology for high performance requirements. The problems of poor geometrical resolution, together with high dielectric constant and loss have all contributed to the very limited adoption of thick film for advanced packaging. This paper describes an advanced ceramic based technology using thick film conductors and dielectric. Excellent geometrical properties result from a combination of novel materials and processing, giving line widths better than 25 micron and via geometries better than 50 micron. A novel dielectric material provides a dielectric constant of less than 4, with a loss factor better than 1.10/sup -4/. This technology allows the fabrication of high density circuits and packages, offering many packaging solutions, including MCM, microwave, sensors and displays, all on one substrate. The paper discusses the technology, its processing and performance. It concludes by presenting examples of typical applications.
机译：过去，厚膜技术已广泛用于现代性能包装解决方案，但对于高性能要求，尚无法完全采用薄膜技术。几何分辨率差的问题，以及高介电常数和损耗，都导致了厚膜在高级包装中的应用非常有限。本文介绍了一种使用厚膜导体和电介质的先进陶瓷技术。新颖的材料和工艺相结合，产生了优异的几何特性，线宽优于25微米，几何形状优于50微米。一种新颖的介电材料提供的介电常数小于4，损耗因子优于1.10 / sup -4 /。这项技术允许制造高密度电路和封装，从而在一个基板上提供许多封装解决方案，包括MCM，微波，传感器和显示器。本文讨论了该技术，其处理和性能。最后，通过介绍典型应用示例。

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