EUROPRACTICE-MCM is part of a $20 million microelectronics stimulation programme established by the European Commission in 1995. It is focused on creating a European MCM infrastructure which will facilitate the adoption of advanced and high density packaging technologies in commercial applications. A consortium of research centres and MCM manufacturers has put in place a full design, component supply, prototype, manufacture and test capability which covers all of the principal MCM technologies. This is now being used to facilitate the production of commercial MCM applications. In addition to the creation of the background infrastructure, a number of MCM demonstrator circuits have been manufactured. These serve to promote the technology as well as having real applications potential. The demonstrator circuits include embedded computer, FPGA, industrial controller and power supply modules covering MCM-L and MCM-D technologies. Following the first year of operation, a clear picture of the requirements of a support network have emerged. Issues encountered have included the need to provide convincing evidence of the technical and cost advantages of MCMs. The identification of potential users and the supply of a high level of support to first time users of the technology have also become critical requirements. Another crucial factor is the need to match specialised and dispersed technical resources to the requirements of individual applications. This paper outlines the EUROPRACTICE-MCM activity with emphasis on the design, bare die, manufacture and test issues encountered to date. Measures taken to address the technical and promotional obstacles to MCM adoption are also covered. A summary of the market promotion modules is included.
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