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首页> 外文会议>Electrical Insulation Conference >Foam-in-place dielectric materials for embedment of aircraft and space vehicle electronic networks operating at 3000 volts
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Foam-in-place dielectric materials for embedment of aircraft and space vehicle electronic networks operating at 3000 volts

机译：用于嵌入在3000伏特电压下运行的飞机和航天器电子网络的现场发泡介电材料

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1. Rigid polyurethane foams are feasible for encapsulation of intermediate voltage low-energy networks. From the knowledge of the dielectric system, design packaging voltages in 3 to S kv RMS range appear to be practical. This type of packaging would require careful attention to exposed electrode design so as to reduce dielectric stress levels to acceptable values adjacent to terminals. 2. Foam materials with an adequate closed cell structure will provide elevated insulation in a varying atmospheric environment. This includes changes caused by elevated temperatures and high altitudes as well as prolonged operation while passing through the atmosphere and in the vacuum of space. Thus the advantages of a solid encapsulant or a hermetic sealed container can be achieved by foams. 3. The length of time for which foams may be serviceable has not yet been determined quantitatively at room temperatures. At elevated temperatures in a vacuum environment gas diffusion will increase and a shorter effective life is expected. 4. The foam dielectric provides a design advantage over rigid and elastomeric insulating materials in that it has a unique combination of properties. It is light weight, mechanically and chemically stable, insulates in the intermediate voltage range and is suitable for use with many phases of network packaging for aerospace vehicles. 5. The ease of repairability further enhances the desirability of foam packaging for aerospace applications since complex network packages are seldom made in duplicate. In addition, with the advent of short-delivery schedules for most of today's space vehicles and the lag of component reliability data, part or electronic component replacement in existing hardware is becoming more common. 6. The designer must also consider the need for dissipation of thermal energy when using foam. Thermal profiles should be established under operating conditions to determine if the energy dissipation will cause excessive heating of the compone- ts. High energy dissipation with foam materials will be a problem in both the atmosphere as well as in space. Contrary to this problem, foam will offer thermal insulation which quite often is desirable with spacecraft.
机译：1.硬质聚氨酯泡沫塑料可用于中压低能耗网络的封装。根据电介质系统的知识，设计封装电压在3到S kv RMS范围内似乎是可行的。这种类型的包装将需要特别注意裸露的电极设计，以将介电应力水平降低到与端子相邻的可接受值。 2.具有足够的闭孔结构的泡沫材料将在变化的大气环境中提供较高的隔热性。这包括由高温和高海拔引起的变化，以及在穿过大气层和在真空中时长时间运行所引起的变化。因此，可以通过泡沫实现固体密封剂或气密容器的优点。 3.尚未确定在室温下可使用泡沫的时间长度。在真空环境中升高的温度下，气体扩散会增加，并且预期的有效寿命会缩短。 4.泡沫电介质具有独特的性能组合，与硬质和弹性绝缘材料相比具有设计优势。它重量轻，机械和化学稳定，在中压范围内绝缘，适合与航空航天网络包装的许多阶段一起使用。 5.可维修性的容易性进一步提高了泡沫塑料包装在航空航天应用中的吸引力，因为很少需要重复制作复杂的网络包装。另外，随着当今大多数航天器的短交货期的到来以及零件可靠性数据的滞后，现有硬件中零件或电子零件的更换正变得越来越普遍。 6.设计人员在使用泡沫时还必须考虑散发热能的需要。应在工作条件下建立热曲线，以确定能量消耗是否会导致组件过热。泡沫材料的高能量耗散在大气和空间中都是一个问题。与该问题相反，泡沫将提供绝热，这是航天器经常需要的。

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