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首页> 外文会议>Pan Pacific Microelectronics Symposium >LEAD-FREE BGA PAD DESIGN A COMPARATIVE STUDY OF THE AFFECT OF PAD DIMENSIONS ON THE ATTACHMENT OF AREA ARRAY PACKAGES UTILIZING LEAD-FREE SOLDER PROCESSES AND VARIOUS PASTE PRINT METHODS
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LEAD-FREE BGA PAD DESIGN A COMPARATIVE STUDY OF THE AFFECT OF PAD DIMENSIONS ON THE ATTACHMENT OF AREA ARRAY PACKAGES UTILIZING LEAD-FREE SOLDER PROCESSES AND VARIOUS PASTE PRINT METHODS

机译：无铅BGA焊盘设计垫尺寸对利用无铅焊料工艺和各种粘贴印刷方法的面积阵列包装附件的影响的比较研究

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摘要

The use of the Area Array Package and in particular, Ball Grid Array (BGA) technology in the electronics industry continues to increase due to the fact that this package type allows for a greater I/O count in a smaller area while maintaining a pitch that allows for ease of manufacture. The original assembly process, and to a large extent the rework process for BGA devices utilizing tin/lead solder materials, has proven to be fairly trouble-free. Environmental and legislative concerns are forcing many manufacturing facilities to transition to lead-free materials and processes. As the circuit density on the printed circuit boards (PCBs) continues to increase, there are two choices for how to accomplish this and the associated BGA escape routing. One of the choices is to increase the signal routing on the topside of BGA land patterns. Once conductor widths and spaces have been minimized, reduction of the pad diameters of the BGA land patterns to accommodate the additional signal routing will be necessary. The other alternative is to increase the signal routing on internal layers. As BGA land pattern diameters vary, this may have some effect on the long-term reliability of the BGA solder joints. Most of our data on the reliability of land pattern design is based on the use of tin/lead solder. It is now common knowledge that lead-free solder will exhibit reduced wetting when compared to traditional tin/lead solders. As more and more assemblies are transitioned to lead-free materials, it is important to understand what impact the variables of pad diameter and wetting will have on the reliability of these lead-free assemblies. This paper will review the results of thermal cycling of BGA samples that were processed with lead-free materials utilizing different solder paste print methods, and different BGA land pattern diameters.
机译：由于这种包装类型允许在较小的区域中允许更大的I / O计数，因此使用区域阵列包装尤其在电子行业中的球网阵列（BGA）技术继续增加，同时保持音高允许易于制造。原始装配过程，以及在很大程度上利用锡/铅焊料材料的BGA器件的返工过程已经证明是不损失的。环境和立法担忧正在强迫许多制造工具转型到无铅材料和流程。随着印刷电路板（PCB）上的电路密度继续增加，有两种选择如何实现此功能和相关的BGA逃生路由。其中一个选择是增加BGA土地模式的顶端信号路由。一旦导体宽度和空间被最小化，就需要减小BGA陆地图案的焊盘直径以容纳附加信号路由。另一种替代方案是增加内部层上的信号路由。随着BGA土地图案直径变化，这可能对BGA焊点的长期可靠性产生一些影响。我们关于土地图案设计可靠性的大多数数据基于使用锡/铅焊料。与传统的锡/铅焊料相比，无铅焊料的常识表明，无铅焊料将表现出降低润湿。随着越来越多的组件被转变为无铅材料，重要的是要理解垫直径和润湿变量的影响是对这些无铅组件的可靠性的影响。本文将审查使用不同焊膏印刷方法的无铅材料加工的BGA样品的热循环结果，以及不同的BGA陆地图案直径。

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