Photovoltaic module reliability studies are essential in understanding both the technical and commercial design lives of various photovoltaic modules.To date, photovoltaic module reliability studies have primarily focused on retention of initial power when exposed to various environmental stresses. While power of a pv module is one reliability measure, the fundamental parameters affecting photovoltaic module stability are typically not measured for baseline analysis. This study examines these questions in context of fundamental parameters, in an attempt to gain insight at a more elemental level than possible using power measurements.Reliability parameters must be identified, and analyzed in a systematic and statistical method. One of these fundamental parameters in pv module reliability is the adhesion of the encapsulant EVA to various module surfaces.The analysis of surface adhesion, both in its initial state, and as it changes with various exposures is studied here, primarily focusing on adhesion of EVA to glass, cell surfaces and the interconnect ribbon. Of particular interest is the affect of manufacturing processes and surface cleanliness on this bond strength.Siemens Solar Industries, with Springborn Laboratories have begun analyzing adhesion of EVA using a systematic and statistical method of sample coupons measured at multiple points, and through numerous exposures. Specifically, several EVA types were compared for adhesion characteristics. Measurements of EVA adhesion and how it is affected by surface contamination due to residual solder fluxhave also been specifically quantified. The summary analysis looked at EVA bonds as a function of environmental exposures.The results of this analysis shows that initial strength of EVA bonds are quite high, these are diminished by both surface contamination effects and environmental exposures. The ultimate bond strength and the ratio to the initial value are variable dependant upon the exposure.
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