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首页> 外文会议>International VLSI multilevel interconnection conference;VMIC >Evolution of Aluminum Target Orientation and its Influence on Deposited Film Uniformity at Early Life Sputtering
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Evolution of Aluminum Target Orientation and its Influence on Deposited Film Uniformity at Early Life Sputtering

机译：铝溅射时靶材取向的演变及其对沉积膜均匀性的影响

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摘要

The effect of target machining on thin film deposition for an Al-0.5wt.%Cu target was investigated. With the aid of X-ray diffraction, the (111) grain orientation, introduced by machining, was identified as the contributor for poor film uniformity, > 1% (1-sigma), obtained at early target life. With the increase of sputtering life up to 15 kwh , the (111) grain orientation was minimized and a better film uniformity, < 0.6% (1-sigma), was obtained. It was concluded that by minimizing the (111) grain orientation during target machining, a shorter burn- in time can be achieved.
机译：研究了靶加工对Al-0.5wt。％Cu靶的薄膜沉积的影响。借助于X射线衍射，通过机加工引入的（111）晶粒取向被确定为在早期目标寿命时获得的薄膜均匀性差> 1％（1-sigma）的原因。随着溅射寿命增加到15 kwh，（111）晶粒取向被最小化，并且获得了更好的薄膜均匀性，<0.6％（1-sigma）。结论是，通过最小化目标加工过程中的（111）晶粒取向，可以实现更短的预烧时间。

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