Improved TiN-Based Diffusion Barrier Using Multilayered Ti/TiN Structure

机译：多层Ti / TiN结构的改进的基于TiN的扩散阻挡层

获取原文

页面导航

摘要
著录项
相似文献
相关主题

摘要

In this study, a novel TiN-based diffusion barrier with multilayered Ti/TiN structure was proposed and successfully applied to Cu and Al metallization. TiN-based diffusion barrier with multilayered Ti/TiN structure was formed by inserting thin Ti layers. Columnar grain structure of TiN was discontinuous while a thin Ti layer was inserted in TiN. It is found that it is a more effective diffusion barrier in Cu and Al metallization than TiN alone. Failure temperature of TiN-based diffusion barrier was increased by multilayered Ti/TiN structure.

机译：在这项研究中，提出了一种具有多层Ti / TiN结构的新型基于TiN的扩散势垒，并成功地应用于Cu和Al的金属化。通过插入薄的Ti层形成具有多层Ti / TiN结构的基于TiN的扩散阻挡层。 TiN的柱状晶粒结构不连续，而在TiN中插入了一层薄的Ti层。已经发现，与单独的TiN相比，它在Cu和Al金属化中是更有效的扩散阻挡层。 TiN / TiN多层结构提高了TiN基扩散阻挡层的失效温度。

著录项

来源
《International VLSI multilevel interconnection conference;VMIC》|2000年|p.490-492|共3页
会议地点
作者
Wen-Fa Wu; Kou-Chiang Tsai; Chuen-Guang Chao; Chi-Feng Huang; Shinn-Tyan Wu; Yu-Lung Chin; Bi-Shiou Chiou;
展开▼
作者单位

展开▼
会议组织
原文格式 PDF
正文语种
中图分类无线电电子学、电信技术;
关键词

相似文献

外文文献
中文文献
专利

1. Novel Multilayered Ti/TiN Diffusion Barrier for Al Metallization [J] . WEN-FA WU, KOU-CHIANG TSAI, CHUEN-GUANG CHAO, Journal of Electronic Materials . 2005,第8期

机译：用于铝金属化的新型多层Ti / TiN扩散阻挡层
2. PECVD-Ti/TiN_x Barrier with Multilayered Amorphous Structure and High Thermal Stability for Copper Metallization [J] . Wen-Fa Wu, Keng-Liang Ou, Chang-Pin Chou Electrochemical and solid-state letters . 2003,第2期

机译：具有多层非晶结构和高热稳定性的铜金属化PECVD-Ti / TiN_x势垒
3. Problems in Measurements of Parameters of Elements and Structures in Modern Micro- and Nanoelectronics Considering TiN/Ti Diffusion Barrier Structures As an Example [J] . D. I. Smirnov, R. M. Giniyatyllin, I. Yu. Zyulkov, Technical physics letters: Letters to the Russian journal of applied physics . 2013,第7期

机译：以TiN / Ti扩散势垒结构为例的现代微纳电子中元素和结构参数的测量问题
4. Multilayered Nanocomposites with High Aspect Ratio Platelets/Low Tg Phosphate Glass: Controlled Interdiffusion and Improved Gas Barrier Properties [C] . Kevin Meyers, Matthew Hebert, Jeremy Decker PMSE Symposia . 2012

机译：具有高纵横比血小板/低Tg磷酸玻璃的多层纳米复合材料：控制间隔和改善的阻气性
5. Al/Ti(x)W(1-x) metal/diffusion-barrier systems: Interfacial reaction paths and kinetics as a function of composition and microstructure. [D] . Bergstrom, Daniel Brian. 1997

机译：Al / Ti（x）W（1-x）金属/扩散阻挡系统：界面反应路径和动力学随成分和微观结构的变化。
6. Enhanced Ti0.84Ta0.16N diffusion barriers grown by a hybrid sputtering technique with no substrate heating between Si(001) wafers and Cu overlayers [O] . Marlene Mühlbacher, Grzegorz Greczynski, Bernhard Sartory, -1

机译：在Si（001）晶片和Cu覆盖层之间通过混合溅射技术生长的增强的Ti0.84Ta0.16N扩散阻挡层无需基板加热即可生长
7. Working efficiency of cutting tools with multilayer nano-structured Ti-TiCN-(Ti,Al)CN and Ti-TiCN-(Ti,Al,Cr)CN coatings: Analysis of cutting properties, wear mechanism and diffusion processes [O] . Alexey A. Vereschaka, Sergey N. Grigoriev, Nikolay N. Sitnikov, 2017

机译：具有多层纳米结构Ti-TiCN-（Ti，Al）CN和Ti-TiCN-（Ti，Al，Cr）CN涂层的切削刀具的工作效率：切割性能，磨损机构和扩散过程分析

Improved TiN-Based Diffusion Barrier Using Multilayered Ti/TiN Structure

摘要

著录项

相似文献

相关主题

期刊订阅