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首页> 外文会议>Proceedings of 2008 international conference on electronic packaging technology high density packaging (ICEPT-HDP 2008) >Manufacture, Microstructure and Microhardness Analysis of Sn-Bi Lead-Free Solder Reinforced with Sn-Ag-Cu Nano-particles
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Manufacture, Microstructure and Microhardness Analysis of Sn-Bi Lead-Free Solder Reinforced with Sn-Ag-Cu Nano-particles

机译：Sn-Ag-Cu纳米粒子增强Sn-Bi无铅焊料的制备，组织和显微硬度分析

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摘要

This paper investigates a composite solders obtained by adding Sn-3.0Ag-0.5Cu (SAC) nano-particles into conventional eutectic Sn-58Bi solder paste. The microstructure analysis and the measurement of the Vickers microhardness have been carried out. Utilizing the self-developed Consumable-electrode Direct Current Arc (CDCA) technique, the Sn-3.0Ag-0.5Cu nano-particles with an average particle size between 20 and 80nm are prepared.The reinforced lead-free Sn-Bi solder was prepared by thoroughly blending the nanometer-sized SAC particles into the eutectic Sn-Bi solder paste. The SAC reinforced Sn-Bi composite solder paste was printed onto ENIG/Cu metalized substrate and reflowed in a conventional reflow oven. After reflow, the morphology of the as-solidified reinforced composite solder was observed by means of SEM and TEM.The Vickers microhardness measurements indicated that the addition of SAC nano-particles enhances the overall strength of the eutectic solder, and the results agree well with the theory of dispersion strengthening.
机译：本文研究了通过将Sn-3.0Ag-0.5Cu（SAC）纳米颗粒添加到传统的共晶Sn-58Bi焊膏中而获得的复合焊料。已经进行了显微组织分析和维氏显微硬度的测量。利用自行开发的消耗电极直流电弧技术，制备了平均粒径为20-80nm的Sn-3.0Ag-0.5Cu纳米粒子，并制备了增强型无铅Sn-Bi焊料。通过将纳米尺寸的SAC颗粒充分共混到共晶Sn-Bi焊膏中。将SAC增强的Sn-Bi复合锡膏印刷到ENIG / Cu金属化的基材上，并在常规回流炉中回流。回流后，通过SEM和TEM观察了凝固后的增强复合焊料的形貌。维氏显微硬度测量表明，添加SAC纳米颗粒可提高共晶焊料的整体强度，结果与之相吻合。分散强化理论。

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