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首页> 外文会议>36th Annual Conference on IEEE Industrial Electronics Society >Automatic optical inspection for detecting defective solders on printed circuit boards
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Automatic optical inspection for detecting defective solders on printed circuit boards

机译：自动光学检查以检测印刷电路板上的不良焊料

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摘要

Automated systems based on optical inspection are widely used in the production of electronic systems, mainly on the printed circuit board level. Detection of defects in the early stages of production, reduce costs by lowering the number of scraps and elevate overall quality standards. One of the main areas where defects arise, are in the solders of the components on printed circuit boards. This paper studies an implementation of an automated optical inspection system for detection of defective solder in through-hole components. The solution implemented in this system, relies on the correct thresholding of the acquired image and afterwards particle analysis on a rule-based approach, instead of using techniques such as template matching to compare the solders to a known template. The proposed solution reduces the overall processing time and makes for a more flexible solution. The experimental results show the efficiency of the proposed approach with a high rate of success using a minimum cycle time.
机译：基于光学检查的自动化系统广泛用于电子系统的生产中，主要用于印刷电路板级。在生产的早期阶段检测缺陷，通过减少废品的数量来降低成本，并提高整体质量标准。出现缺陷的主要区域之一是印刷电路板上组件的焊料。本文研究了一种用于检测通孔组件中的不良焊料的自动光学检查系统的实现。在此系统中实施的解决方案依赖于正确采集的图像阈值，然后基于基于规则的方法进行粒子分析，而不是使用诸如模板匹配之类的技术将焊料与已知模板进行比较。所提出的解决方案减少了整体处理时间，并使解决方案更加灵活。实验结果表明，所提出的方法的效率高，使用最少的周期时间可以取得较高的成功率。

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