首页> 外文会议>European Photovoltaic Solar Energy Conference and Exhibition >INVESTIGATION OF INTERFACE BETWEEN SPUTTERED NIV/AG AND TCO LAYER IN BACK SIDE METALLIZATION FOR HIGH EFFICIENCY HETEROJUNCTION SOLAR CELL
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INVESTIGATION OF INTERFACE BETWEEN SPUTTERED NIV/AG AND TCO LAYER IN BACK SIDE METALLIZATION FOR HIGH EFFICIENCY HETEROJUNCTION SOLAR CELL

机译:高效异质结太阳能电池后侧金属化溅射NIV / AG和TCO层界面的研究

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The silicon heterojunction (SHJ) technology is evolving rapidly with new concepts and ideas for systematically improve efficiency and decrease cost. Using the sputtered NiV/Ag film to substitute standard screen printing technology in the back side is common method to reduce the cost. In this work, we report on the first observation of the adhesives problem in the interface between Ag film and transparent conducting oxide (TCO) layer when the ribbons are standard soldering on the cell, and propose ways to improve it. This work focuses on analyzing the interface and adhesion for heterojunction solar cells. Especially the formed amorphous on TCO layer will be discussed and compared to standard without amorphous TCO layer. Electrical characterizations, adhesive strength tests have been used to quantify the characteristics of the cell performance. It will be shown that a long term stable structure with amorphous TCO layer is possible with industrial methods.
机译:硅异质结(SHJ)技术正在快速发展,以便系统地提高效率和降低成本的新概念和思路。在背面替代标准丝网印刷技术的溅射NIV / AG胶片是降低成本的常用方法。在这项工作中,当带子在电池上标准焊接时,我们报告了Ag膜和透明导电(TCO)层之间的界面中的粘合剂问题的首次观察,并提出了改进的方法。这项工作侧重于分析异质结太阳能电池的界面和粘附性。特别是TCO层上所形成的无定形物将被讨论并与标准的标准进行比较,没有无定形TCO层。电学特性,粘合强度试验已用于量化细胞性能的特性。将表明,具有工业方法可以实现具有非晶TCO层的长期稳定结构。

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