Verification of Non-Uniform Heat-Conducting Interphase by Using Finite Element Method

机译：有限元法验证非均匀导热相

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摘要

In this paper,various temperature distributions on a thin resistant interphase layer bonded between two different materials were studied.The numerical finite element analysis for heatconduction problems is considered for two cases:namely,a temperature-dependent source or sink and non-uniform temperature distributions at the surfaces and non-uniform source distributions into the intermediate layer.The finite element analysis shows good performance for thin heat conducting adhesive layers.

机译：本文研究了两种不同材料之间粘结的薄电阻相间层上的温度分布。考虑了两种情况下导热问题的数值有限元分析：即温度相关的源或汇和温度分布不均匀。有限元分析显示了薄的导热粘合剂层的良好性能。

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《International conference on frontiers of manufacturing and design science》|2012年|4897-4901|共5页
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Hamid Mozafari; Behzad Abdi; Amran Ayob; Amran Alias;
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正文语种
中图分类机械制造工艺;
关键词
Imperfect interface; Non-uniform; Finite element analysis; Interphase;

机译：界面不完善;不均匀有限元分析;相间;

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2. 采用有限元法设计电磁成形的非均匀线圈（英文） [J] . M．AHMED, S．K．PANTHI, N．RAMAKRISHNAN, 中国有色金属学报：英文版 . 2011,第003期
3. Finite Element Verification of Transmission Conditions for Thin Reactive Heat-Conducting interphases [J] . Andreas Ochsner, Wiktoria Miszuris Diffusion and Defect Data. Solid State Data, Part A. Defect and Diffusion Forum . 2008,第0期

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Verification of Non-Uniform Heat-Conducting Interphase by Using Finite Element Method

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