首页> 外文会议>Microwave Radar and Wireless Communications (MIKON), 2012 19th International Conference on >Sheet resistance and conductivity measurements of rough surfaces of metals on printed circuit boards and metalized ceramic substrates
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Sheet resistance and conductivity measurements of rough surfaces of metals on printed circuit boards and metalized ceramic substrates

机译:印刷电路板和金属化陶瓷基板上金属粗糙表面的薄层电阻和电导率测量

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In copper cladded laminates copper foil is roughened to promote adhesion of the dielectric resin. Sheet resistance of rough metal surfaces increases as a function of frequency, thus increasing signal attenuation. In this paper we present measurements of the sheet resistance of rough metal surfaces on several commercially available copper cladded laminates and on metalized ceramic substrates.
机译:在覆铜层压板中,铜箔被粗糙化以促进介电树脂的粘附。粗糙金属表面的薄层电阻随频率增加而增加,从而增加了信号衰减。在本文中,我们介绍了几种可商购的覆铜层压板和金属化陶瓷基板上粗糙金属表面的薄层电阻的测量结果。

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