• 主题
高级搜索  >
历史搜索 清空历史
首页> 外文会议>International symposium on microelectronics >A Low Firing Temperature Copper Conductor for use on an Aluminum Metal Compatible Dielectric in LED Thermal Substrate Applications
【24h】

A Low Firing Temperature Copper Conductor for use on an Aluminum Metal Compatible Dielectric in LED Thermal Substrate Applications

机译：一种低灼烧温度的铜导体，用于LED热基板应用中与铝金属兼容的电介质

获取原文
页面导航
  • 摘要
  • 著录项
  • 相似文献
  • 相关主题

摘要

One of the most important contributing factors in the long life of LEDs (Light Emitting Diode) is keepingthem cool, i.e., lowering the junction temperature, which can get as high as 150 °C. One way to accomplish thiswhen building a circuit containing many LED packages is to use a thermal substrate. The majority of HighPower/High Brightness (HP/HB) LED thermal circuits manufactured today are based on Metal Core PrintedCircuit Board (MCPCB) technology. The MCPCB system consists of a copper foil, polymer dielectric layer andeither an aluminum or copper base layer that are laminated together. The process of making MCPCB is asubtractive process, where most of the copper foil is removed. The copper foil is etched to create a circuit layer, thepolymer dielectric provides the insulation between the copper foil and the metal base, and the aluminum or copperbase provides thermal dissipation.The thick film copper paste discussed in this document is processed using an additive process, likescreening printing, where the copper conductor is deposited only in the chosen area. The copper thick film paste isscreen printed to create a circuit design on top of a thick film dielectric (insulated area) layer which is also printedon a metal base layer. The selective deposition allows for less material usage, and potentially lower overall cost aswell as improved thermal performance with inclusion of thermal vias.This paper discusses the results of a newly developed lead (Pb) and cadmium (Cd) free low firingtemperature (580-600°C) copper thick film conductor paste on top of a low temperature firing dielectric paste. Thisstudy includes evaluations based on SEM photos, solderability, leach resistance, and initial and long term adhesionsusing SAC 305 solder and RMA flux. There are many different applications for HP/HB LED circuits, from generallighting to street lighting to automotive lighting and more. All of them have varying degrees of performance testingrequirement. To try to cover as much of the reliability testing as possible we have included tests such as thermalaging (150°C), thermal cycling from -50 to+150°C, as well as 85°C/85% RH reliability testing under bias.
机译：保持LED长寿命的最重要因素之一就是发光二极管 它们会冷却，即降低结温，结温可能会高达150°C。一种实现此目的的方法 当构建包含许多LED封装的电路时，请使用导热基板。多数高 今天生产的功率/高亮度（HP / HB）LED热电路基于金属芯印刷 电路板（MCPCB）技术。 MCPCB系统由铜箔，聚合物电介质层和 层压在一起的铝或铜基层。制作MCPCB的过程是 减法工艺，其中大部分铜箔被去除。蚀刻铜箔以创建电路层， 聚合物电介质在铜箔和金属基底以及铝或铜之间提供绝缘 基座提供散热。 本文档中讨论的厚膜铜浆使用加成工艺进行处理，例如 丝网印刷，其中铜导体仅沉积在所选区域中。铜厚膜膏是 丝网印刷以在厚膜电介质（绝缘区域）层的顶部创建电路设计，该层也要印刷 在金属基层上。选择性沉积可减少材料使用量，并有可能降低总体成本，因为 包括散热孔，改善了散热性能。 本文讨论了新开发的无铅和无镉低烧成法的结果 温度（580-600°C）的铜厚膜导体浆料放在低温烧成的电介质浆料上。这 研究包括基于SEM照片，可焊性，耐溶出性以及初始和长期附着力的评估 使用SAC 305焊料和RMA助焊剂。一般而言，HP / HB LED电路有许多不同的应用 照明，街道照明，汽车照明等等。他们都有不同程度的性能测试 要求。为了涵盖尽可能多的可靠性测试，我们提供了热测试等测试。 老化（150°C），从-50到+ 150°C的热循环以及在偏置下进行的85°C / 85％RH可靠性测试。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱：kefu@zhangqiaokeyan.com

京公网安备：11010802029741号 ICP备案号：京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有

  • 客服微信

  • 服务号