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Position determination of a ball grid array by automated optical inspection method

机译:通过自动光学检测方法定位球网格阵列

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This paper introduces a novel automated optical inspection (AOI) method to measure the positions and diameters of micro-solder balls of a ball grid array (BGA). The method is focused on the refinement of optical configuration, image acquisition platform design to improve the time efficiency of AOI. We use a white LED ring as a light source. It is combined with the platform. The system can perform multiple image processing and object detection steps to locate the center of each ball. This paper also presents two methods to estimate the diameters of the balls. A dummy BGA, consists of misaligned solder balls, are assembled to a conductive substrate to evaluate the platform. Test result shows that the platform is capable of performing continuous image acquisition of a 15fps, 640 × 480, 8-bite grayscale video.
机译:本文介绍了一种新型的自动化光学检查(AOI)方法,测量球栅阵列(BGA)的微焊球的位置和直径。该方法专注于光学配置的改进,图像采集平台设计,提高AOI的时间效率。我们使用白色LED环作为光源。它与平台相结合。系统可以执行多个图像处理和对象检测步骤以定位每个球的中心。本文还呈现了两种方法来估计球的直径。虚拟BGA包括未对准的焊球,组装到导电基板以评估平台。测试结果表明,该平台能够执行15fps,640×480,8磅灰度视频的连续图像采集。

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