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首页> 外文会议>IEEE International Conference on Power Electronics and Drive Systems >Study on Accurate Thermal Modeling of Press-Pack IGBT Module with Asymmetric Double-Side Cooling Structure based on Structure Function Curve by Orthogonal Experimental Design
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Study on Accurate Thermal Modeling of Press-Pack IGBT Module with Asymmetric Double-Side Cooling Structure based on Structure Function Curve by Orthogonal Experimental Design

机译：基于结构函数曲线的正交试验设计基于结构函数曲线的压力包IGBT模块精确热建筑研究

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摘要

Press-pack insulated gate bipolar transistor (PP IGBT) has been applied to large-scale Voltage Source Converter based High Voltage Direct Current Transmission (VSC-HVDC) applications. It has a multi-layered structure, the internal electrical and thermal contact are maintained by external clamping force along with internal disc springs. In this paper, a finite element simulation model is presented, which can correct the material properties and interfacial thermal resistance of the device based on structure function curve. It obtains the structure function curve through deconvolution and network transformation. By using Bahrami plastic contacting thermal resistance model and orthogonal experimental design, contacting thermal resistance can be predicted and thermal model converges rapidly, respectively. Comparison between simulated and experimental structural function curve when FRD works in the same module has verified the thermal model.
机译：按压包装绝缘栅双极晶体管（PP IGBT）已应用于基于大型电压源转换器的高压直流传输（VSC-HVDC）应用。它具有多层结构，内部电气和热触点由外部夹紧力以及内圆盘弹簧保持。本文提出了一种有限元模拟模型，可以校正基于结构函数曲线的器件的材料特性和界面热阻。它通过去卷积和网络转换获得结构函数曲线。通过使用Bahrami塑料接触热阻模型和正交的实验设计，可以预测接触热阻，热模型分别快速收敛。模拟和实验结构函数曲线之间的比较当FRD在同一模块中工作已经验证了热模型。

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