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首页> 外文会议>International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems >Multi-scale numerical-experimental method to determine the size dependent elastic properties of bilayer silicon copper nanocantilevers using an electrostatic pull in experiment
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Multi-scale numerical-experimental method to determine the size dependent elastic properties of bilayer silicon copper nanocantilevers using an electrostatic pull in experiment

机译：多标数实验方法确定双层硅铜纳米膜在实验中静电拉动硅铜纳米膜尺寸的尺寸依赖性性能

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摘要

Thin metal films are widely used in modern electro mechanical systems. The need for more integrated functionality and minimization of material and energy consumption leads to miniaturization of these systems. As a consequence, materials are processed on the micro- and nanometer scale. On this scale, material properties become a function of size. To predict performance and reliability, knowledge on the size dependence of material properties is imperative. In this work the unknown size dependence of the copper Young's modulus is determined by electrostatic pull-in experiments performed on bilayer copper-silicon nanocantilevers. The size effect is also predicted with a multi-scale (MS) method. In this method atomistic simulations predict the bulk elastic and surface properties of mono-crystalline silicon (Si) and poly-crystalline copper (Cu). These results are combined to represent the bilayer nanocantilevers of the experiment in a continuum model. The model is verified by comparison with a well documented size effect of the effective Si Young's modulus. It is shown that the experimental method can be used for determining the Young's modulus of thin Cu films in the 10 to 50 nm range. Both the experimental results and the MS simulation results show that there is a strong size effect present in Si and Cu.
机译：薄金属薄膜广泛用于现代电力机械系统。需要更集成的功能和最小化材料和能量消耗导致这些系统的小型化。结果，材料在微型和纳米尺度上加工。在此规模上，材料属性成为大小的函数。为了预测性能和可靠性，对材料属性的尺寸依赖性的知识是必要的。在这项工作中，铜杨氏模量的未知尺寸依赖性由在双层铜 - 硅纳米纳米膜上进行的静电引入实验确定。还以多尺度（MS）方法预测尺寸效果。在该方法中，原子仿真预测单晶硅（Si）和聚结晶铜（Cu）的大部分弹性和表面性质。这些结果组合以表示连续模型中实验的双层纳米膜。通过与有效的Si杨氏模量的良好记录尺寸效应进行验证，验证该模型。结果表明，实验方法可用于确定10至50nm范围内的薄Cu膜的杨氏模量。实验结果和MS仿真结果均表明，Si和Cu存在强大的效果。

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