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Pressure free sintering of silver nanoparticles to silver substrate using weakly binding ligands

机译:使用弱结合配体的银纳米粒子的无压烧结到银基质

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The use of a weakly binding ligand to facilitate sintering between particles and a planar substrate in the absence of pressure and at low homologous temperature has been explored. Ag nanoparticles in the 5–15 nm range suspended in water and stabilized by a BH4 complex were dropped onto a polished Ag substrate heated to 333 K. The Ag particles sintered to each other and to the substrate to form a largely pore free system. A molecular dynamics simulation is used to understand the theoretical limits of pressure free sintering and practical implications for adhesive systems based on Ag nanoparticle suspensions are discussed.
机译:探讨了在没有压力和低同质温度的情况下促进颗粒和平面衬底之间的烧结和平面衬底之间的含有弱结合配体。将5-15​​nm范围内悬浮在水中并通过BH4络合物稳定的Ag纳米颗粒滴到加热至333k的抛光Ag底物上。彼此烧结的Ag颗粒和基底以形成主要的无孔系统。讨论了分子动力学模拟来了解基于Ag纳米粒子悬浮液的粘合剂系统的无压烧结和实际意义的理论限制。

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