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首页> 外文会议>IEEE Workshop on control and modeling for power electronics >Real-time thermal monitoring of power semiconductors in power electronics using linear parameter-varying models for variable coolant flow situations
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Real-time thermal monitoring of power semiconductors in power electronics using linear parameter-varying models for variable coolant flow situations

机译：用于可变冷却液流动情况的线性参数改变模型的电力电子设备功率半导体的实时热监测

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摘要

Real-time thermal monitoring of power-semiconductor temperatures is an important task to establish thermal protection within a water-cooled power-electronic inverter unit. A model-based method is presented, which estimates the junction temperatures. Via feedback of measured temperature signals, the observer system is also able to estimate the coolant temperature. However, if the module is cooled by variable coolant flow rates, the heat transfer coefficient from heat sink to coolant changes. Consequently, the estimated coolant temperature of the observer system based on a static thermal model becomes inaccurate. This paper proposes a method to adapt the thermal model dependent on the current coolant flow rate using a parameter-varying system design.
机译：功率半导体温度的实时热监测是建立水冷电力 - 电子逆变器单元内的热保护的重要任务。提出了一种基于模型的方法，其估计了结温。通过测量温度信号的反馈，观察者系统也能够估计冷却剂温度。然而，如果模块通过可变冷却剂流速冷却，则从散热器到冷却剂的传热系数变化。因此，基于静态热模型的观察者系统的估计冷却剂温度变得不准确。本文提出了一种使用参数变化系统设计来适应电流冷却剂流量的热模型的方法。

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