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Evaluation of the effect of stress relief slots on QFN strip warpage using finite element analysis

机译：使用有限元分析评估应力释放槽对QFN钢带翘曲的影响

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摘要

QFN (Quad Flat No-lead) packages become popular in recent years because they provide many advantages over conventional leadframe packages. Due to CTE (Coefficient of Thermal Expansion) mismatch of different materials applied in the package, significant warpage will be generated during QFN packaging process, and may cause yield and reliability issues. In this paper, the warpage of a QFN strip induced by molding process was simulated using finite element analysis (FEA). Effect of stress relief slots design of the leadframe was evaluated, and the influence of material properties was also studied with three different types of EMC (Epoxy Molding Compound). Simulation results indicated that CTE of the EMC had a considerable effect on the warpage direction and magnitude, and the existence of stress relief slots only slightly reduced warpage magnitude.
机译：近年来，QFN（四方扁平无铅）封装变得越来越流行，因为它们比传统的引线框架封装具有许多优势。由于封装中使用的不同材料的CTE（热膨胀系数）不匹配，在QFN封装过程中会产生明显的翘曲，并可能导致良率和可靠性问题。在本文中，利用有限元分析（FEA）模拟了成型过程导致的QFN带材的翘曲。评估了引线框架的应力消除槽设计的效果，并且还使用三种不同类型的EMC（环氧树脂模塑料）研究了材料性能的影响。仿真结果表明，EMC的CTE对翘曲方向和幅度有很大影响，而应力消除槽的存在只会稍微降低翘曲幅度。

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