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Comparative analysis of novel thermal interface containing nano additives

机译：新型含纳米添加剂热界面的比较分析

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Nowadays a passive cooling based on efficient reliable thermal interfaces begins to play a dominant role in modern consumer electronics. The devices become smaller, thinner and more powerful while semiconductors become the source of higher flux heat density. In order to reduce thermal resistance between a semiconductor junction and a heat spreader, semiconductor structures remain unpackaged i.e. flip-chip structures. In the case of such solution semiconductor dies have a direct contact with a heat spreader (i.e. surface of metal radiators). In order to decrease thermal resistance of the contact some Thermal Interface Material (TIM) is usually applied. A TIM should form a low thermal resistance contact and ensure a long term stable interconnection in respect of its thermo-mechanical properties. Within the frame of the study three novel sintered nano silver pastes and one commercially available thermally conductive adhesive were compared and evaluated as potential TIMs. Formed thermal interfaces between power transistors and copper substrates were assessed in respect of their structure (X-Ray computed tomography) and heat dissipation performance (IR thermography).
机译：如今，基于高效可靠的热界面的被动冷却开始在现代消费电子产品中起主导作用。当半导体成为高通量热密度的来源时，器件变得更小，更薄，功能更强大。为了减小半导体结与散热器之间的热阻，半导体结构保持未封装，即倒装芯片结构。在这种溶液的情况下，半导体管芯与散热器（即金属散热器的表面）直接接触。为了降低触点的热阻，通常使用一些热界面材料（TIM）。 TIM应该形成低热阻触点，并在其热机械特性方面确保长期稳定的互连。在研究框架内，对三种新型烧结纳米银浆和一种市售导热胶进行了比较，并将其评估为潜在的TIM。评估了功率晶体管和铜基板之间形成的热界面的结构（X射线计算机断层扫描）和散热性能（红外热成像）。

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